JAJSIO5B July   2019  – February 2020 LMR36506-Q1

ADVANCE INFORMATION for pre-production products; subject to change without notice.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      概略回路図
      2.      効率と出力電流の関係 VOUT = 3.3V (固定)、2.2MHz
  4. 4 改訂履歴
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD (Automotive) Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 System Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Output Voltage Selection
      2. 8.3.2  Enable and Start-up
      3. 8.3.3  External CLK SYNC (with MODE/SYNC)
      4. 8.3.4  Adjustable Switching Frequency (with RT)
      5. 8.3.5  Power-Good Flag Output
      6. 8.3.6  Internal LDO, VCC UVLO, and VOUT/BIAS Input
      7. 8.3.7  Bootstrap Voltage and VCBOOT-UVLO (CBOOT Terminal)
      8. 8.3.8  Spread Spectrum
      9. 8.3.9  Soft Start and Recovery from Dropout
        1. 8.3.9.1 Recovery from Dropout
      10. 8.3.10 Current Limit and Short Circuit
      11. 8.3.11 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Active Mode
      4. 8.4.4 Continuous Conduction Mode (CCM)
      5. 8.4.5 Discontinuous Conduction Mode (DCM)
      6. 8.4.6 Pulse Frequency Modulation (PFM)
      7. 8.4.7 Forced Pulse Width Modulation Mode (FPWM)
      8. 8.4.8 Dropout Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Choosing the Switching Frequency
        2. 9.2.2.2 Setting the Output Voltage
          1. 9.2.2.2.1 FB for Adjustable Output
        3. 9.2.2.3 Inductor Selection
        4. 9.2.2.4 Output Capacitor Selection
        5. 9.2.2.5 Input Capacitor Selection
        6. 9.2.2.6 CBOOT
        7. 9.2.2.7 VCC
        8. 9.2.2.8 CFF Selection
          1. 9.2.2.8.1 External UVLO
        9. 9.2.2.9 Maximum Ambient Temperature
    3. 9.3 What to Do and What Not to Do
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Ground and Thermal Considerations
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントのサポート
      1. 12.1.1 関連資料
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 サポート・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

9.2.2 Detailed Design Procedure

The following design procedure applies to Figure 9 and Table 1.