SNVS158E March   2001  – December 2016 LMS33460

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Start Up
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Input voltage to GND 8 V
Output voltage to GND 8 V
Output continuous output current 30 mA
Vapor phase IR convection reflow 240 °C
Junction temperature, TJ 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V
Machine model ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN MAX UNIT
TJ Operating junction temperature –40 85 °C

6.4 Thermal Information

THERMAL METRIC(1) LMS33460 UNIT
DCK (SC70)
5 PINS
RθJA Junction-to-ambient thermal resistance 275.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 102.5 °C/W
RθJB Junction-to-board thermal resistance 54 °C/W
ψJT Junction-to-top characterization parameter 2.7 °C/W
ψJB Junction-to-board characterization parameter 53.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

TJ = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VDET Detector threshold VIN falling 2.85 3 3.15 V
VHYS Detector voltage hysteresis VIN rising 0.095 0.155 0.215 V
IIN Input supply current VIN = 2.87 V 1 2.2 µA
VIN = 4.7 V 1.2 3.6 µA
VIN = 7 V(1) 25 200 µA
VIN(MAX) Maximum operating voltage 7 V
VIN(MIN) Minimum operating voltage 0.7 1.1 V
TJ = –40°C to 85°C 1 1.3
IOUT(LOW) Output current low VOUT = 0.05 V, VIN = 1.1 V 0.01 0.6 mA
VOUT = 0.5 V, VIN = 1.5 V 2 11
tPDHL Output delay time (output transition high to low ) CL = 10 pF, RL = 470 kΩ 130 200 µs
ΔVDET/ΔT Detect voltage temperature coefficient TJ = –40°C to 85°C ±120 PPM/°C
(1) Quiescent current increases substantially above 5.5 V, but is very low in the normal range below 5.5 V.

6.6 Typical Characteristics

TA = 25°C, RL = 470 kΩ, and CL = 10 pF (unless otherwise noted)
LMS33460 20020005.gif Figure 1. Detector Threshold vs Temperature
LMS33460 20020006.gif Figure 3. Propagation Delay Time (tPDHL) vs Temperature
LMS33460 20020010.png Figure 5. VOUT(LOW) vs VIN
LMS33460 20020004.gif Figure 2. Supply Current vs Input Voltage
LMS33460 20020007.gif Figure 4. Propagation Delay Time (tPDLH) vs Temperature