JAJSCN9C November   2016  – June 2018 LMT01-Q1

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
    1.     LMT01-Q1の精度
  3. 3 概要
    1.     2ピンのIC温度センサ
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Electrical Characteristics - TO-92/LPG Pulse Count to Temperature LUT
    7. 6.7  Electrical Characteristics - WSON/DQX Pulse Count to Temperature LUT
    8. 6.8  Switching Characteristics
    9. 6.9  Timing Diagram
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Interface
      2. 7.3.2 Output Transfer Function
      3. 7.3.3 Current Output Conversion to Voltage
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Mounting, Temperature Conductivity, and Self-Heating
    2. 8.2 Typical Application
      1. 8.2.1 3.3-V System VDD MSP430 Interface - Using Comparator Input
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Setting the MSP430 Threshold and Hysteresis
        3. 8.2.1.3 Application Curves
    3. 8.3 System Examples
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 ドキュメントの更新通知を受け取る方法
    2. 11.2 コミュニティ・リソース
    3. 11.3 商標
    4. 11.4 静電気放電に関する注意事項
    5. 11.5 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.1 Absolute Maximum Ratings

See (1)(2).
MIN MAX UNIT
Voltage drop (VP – VN) −0.3 6 V
Storage temperature, Tstg −65 175 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.