(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.
(2) RθJA measured on a 2.25-in × 2.25-in (5.8 cm x 5.8 cm) 4-layer board, with 1-oz. copper, thirty six thermal vias, no air flow, and 1-W power dissipation. Refer to Layout or Evaluation Board Application Note AN-2024 LMZ1420x / LMZ1200x Evaluation Board (SNVA422).