JAJSBZ7E JULY   2013  – December 2019 LMZ31710

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      アプリケーション概略図
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics (PVIN = VIN = 12 V)
    7. 6.7 Typical Characteristics (PVIN = VIN = 5 V)
    8. 6.8 Typical Characteristics (PVIN = 3.3 V, VIN = 5 V)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  VIN and PVIN Input Voltage
      2. 7.3.2  3.3-V PVIN Operation
      3. 7.3.3  Adjusting the Output Voltage (0.6 V to 5.5 V)
      4. 7.3.4  Capacitor Recommendations For the LMZ31710 Power Supply
        1. 7.3.4.1 Capacitor Technologies
          1. 7.3.4.1.1 Electrolytic, Polymer-Electrolytic Capacitors
          2. 7.3.4.1.2 Ceramic Capacitors
          3. 7.3.4.1.3 Tantalum, Polymer-Tantalum Capacitors
        2. 7.3.4.2 Input Capacitor
        3. 7.3.4.3 Output Capacitor
      5. 7.3.5  Transient Response
        1. 7.3.5.1 Transient Response Waveforms
      6. 7.3.6  Power Good (PWRGD)
      7. 7.3.7  Light Load Efficiency (LLE)
      8. 7.3.8  SYNC_OUT
      9. 7.3.9  Parallel Operation
      10. 7.3.10 Power-Up Characteristics
      11. 7.3.11 Pre-Biased Start-Up
      12. 7.3.12 Remote Sense
      13. 7.3.13 Thermal Shutdown
      14. 7.3.14 Output On/Off Inhibit (INH)
      15. 7.3.15 Slow Start (SS/TR)
      16. 7.3.16 Overcurrent Protection
      17. 7.3.17 Synchronization (CLK)
      18. 7.3.18 Sequencing (SS/TR)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Programmable Undervoltage Lockout (UVLO)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Setting The Output Voltage
        3. 8.2.2.3 Setting the Switching Frequency
        4. 8.2.2.4 Input Capacitance
        5. 8.2.2.5 Output Capacitance
    3. 8.3 Additional Application Schematics
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Considerations
    2. 10.2 Layout Examples
      1. 10.2.1 EMI
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デバイス・サポート
      1. 11.1.1 開発サポート
        1. 11.1.1.1 WEBENCH®ツールによるカスタム設計
      2. 11.1.2 デベロッパー・ネットワークの製品に関する免責事項
    2. 11.2 ドキュメントのサポート
      1. 11.2.1 関連資料
    3. 11.3 ドキュメントの更新通知を受け取る方法
    4. 11.4 サポート・リソース
    5. 11.5 商標
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 Glossary
  12. 12メカニカル、パッケージ、および注文情報
    1. 12.1 Tape and Reel Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Input voltage VIN, PVIN –0.3 20 V
INH/UVLO, PWRGD, RT/CLK, SENSE+ –0.3 6 V
ILIM, VADJ, SS/TR, STSEL, SYNC_OUT, ISHARE, OCP_SEL –0.3 3 V
Output voltage PH –1.0 20 V
PH 10ns Transient –3.0 20 V
VOUT –0.3 10 V
Source current RT/CLK, INH/UVLO ±100 µA
PH current limit A
Sink current PH current limit A
PVIN current limit A
PWRGD –0.1 2 mA
Operating junction temperature –40 125(2) °C
Storage temperature, Tstg –65 150 °C
Peak Reflow Case Temperature(3) 245(4) °C
Maximum Number of Reflows Allowed(3) 3(4)
Mechanical shock Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted 1500 G
Mechanical vibration Mil-STD-883D, Method 2007.2, 20-2000 Hz 20
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) See the temperature derating curves in the Typical Characteristics section for thermal information.
(3) For soldering specifications, refer to the Soldering Requirements for BQFN Packages application note.
(4) Devices with a date code prior to week 14 2018 (1814) have a peak reflow case temperature of 240°C with a maximum of one reflow.