JAJSF76D September   2015  – June 2018 LMZ36002

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      アプリケーション概略図
      2.      効率と出力電流との関係
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics
    7. 6.7  Typical Characteristics
    8. 6.8  Typical Characteristics
    9. 6.9  Typical Characteristics
    10. 6.10 Typical Characteristics (Thermal Derating)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage
      2. 7.3.2  Switching Frequency (RT)
      3. 7.3.3  Recommended Operating Range
      4. 7.3.4  Synchronization (CLK)
      5. 7.3.5  Output Capacitor Selection
      6. 7.3.6  VERSA-COMP Pin Configurations
      7. 7.3.7  Input Capacitor Selection
      8. 7.3.8  Output On/Off Inhibit (INH/UVLO)
      9. 7.3.9  Under Voltage Lockout (UVLO)
      10. 7.3.10 Remote Sense
      11. 7.3.11 VBSEL
      12. 7.3.12 Soft-Start (SS/TR)
      13. 7.3.13 Power Good (PWRGD) and Pull-up (PWRGD_PU)
      14. 7.3.14 Overcurrent Protection
      15. 7.3.15 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Light Load Operation
      3. 7.4.3 Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Minimum External Component Application
        1. 8.1.1.1 Design Requirements
        2. 8.1.1.2 Detailed Design Procedure
          1. 8.1.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.1.1.2.2 Output Voltage Set-Point
          3. 8.1.1.2.3 RT and RTSEL
          4. 8.1.1.2.4 VERSA-COMP
          5. 8.1.1.2.5 VBSEL
          6. 8.1.1.2.6 Input Capacitors
          7. 8.1.1.2.7 Output Capacitors
          8. 8.1.1.2.8 Application Curves
      2. 8.1.2 Typical Application
        1. 8.1.2.1 Design Requirements
      3. 8.1.3 Detailed Design Procedure
        1. 8.1.3.1 Switching Frequency
        2. 8.1.3.2 Power Good
        3. 8.1.3.3 Inhibit Control
        4. 8.1.3.4 VERSA-COMP
        5. 8.1.3.5 VBSEL
        6. 8.1.3.6 Soft-Start Capacitors
        7. 8.1.3.7 Input Capacitors
        8. 8.1.3.8 Output Capacitors
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 EMI
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デバイス・サポート
      1. 11.1.1 開発サポート
        1. 11.1.1.1 WEBENCH®ツールによるカスタム設計
      2. 11.1.2 デベロッパー・ネットワークの製品に関する免責事項
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 コミュニティ・リソース
    4. 11.4 商標
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Input voltage PVIN, INH/UVLO –0.3 65 V
VOUT, SENSE+, VBSEL –0.3 30(3) V
VADJ, VERSA-COMP, RT, RTSEL, SS/TR –0.3 3.6 V
PWRGD, PWRGD_PU –0.3 15 V
CLK –0.3 5.5 V
Output voltage PH –0.3 65 V
Operating junction temperature(2) –40 125 °C
Storage temperature –65 150 °C
Peak Reflow Case Temperature(4) 245(5) °C
Maximum Number of Reflows Allowed(4) 3(5)
Mechanical shock Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted 1500 G
Mechanical vibration Mil-STD-883D, Method 2007.2, 20-2000Hz 20 G
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) See temperature derating curves in the Typical Characteristics section for thermal information.
(3) The maximum voltage that can be applied to these pins is 30 V or PVIN, whichever is less.
(4) For soldering specifications, refer to the Soldering Requirements for BQFN Packages application note.
(5) Devices with a date code prior to week 14 2018 (1814) have a peak reflow case temperature of 240°C with a maximum of one reflow