JAJSQO6 august   2023 LOG200

ADVANCE INFORMATION  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High Speed, Logarithmic Current-to-Voltage Conversion
      2. 7.3.2 Voltage and Current References
      3. 7.3.3 Adaptive Photodiode Bias
      4. 7.3.4 Auxiliary Operational Amplifier
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Logarithmic Transfer Function
        1. 8.1.1.1 Logarithmic Conformity Error
    2. 8.2 Typical Application
      1. 8.2.1 Optical Current Sensing
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 サード・パーティ製品に関する免責事項
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 ドキュメントの更新通知を受け取る方法
    4. 9.4 サポート・リソース
    5. 9.5 Trademarks
    6. 9.6 静電気放電に関する注意事項
    7. 9.7 用語集
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC (1) LOG200 UNIT
RGT (VQFN)
16 PINS
RθJA Junction-to-ambient thermal resistance 66.7 ℃/W
RθJC(top) Junction-to-case (top) thermal resistance 61.8 ℃/W
RθJB Junction-to-board thermal resistance 39.8 ℃/W
ψJT Junction-to-top characterization parameter 3.8 ℃/W
ψJB Junction-to-board characterization parameter 39.8 ℃/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 31.2 ℃/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.