JAJSPI9H June   2011  – November 2024 LP2951-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics (Both Legacy and New Chip)
    6. 5.6 Timing Requirements (New Chip only)
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Reverse Current
      2. 7.1.2 Input and Output Capacitor Requirements
      3. 7.1.3 Estimating Junction Temperature
      4. 7.1.4 Power Dissipation (PD)
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
        1. 7.2.1.1 Recommended Capacitor Types
          1. 7.2.1.1.1 Recommended Capacitors (Legacy Chip)
            1. 7.2.1.1.1.1 ESR Range (Legacy Chip)
          2. 7.2.1.1.2 Recommended Capacitors (New Chip)
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Feedback Resistor Selection
        2. 7.2.2.2 Feedforward Capacitor
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
      2. 8.1.2 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 ドキュメントの更新通知を受け取る方法
    4. 8.4 サポート・リソース
    5. 8.5 Trademarks
    6. 8.6 静電気放電に関する注意事項
    7. 8.7 用語集
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

9 Revision History

Changes from Revision G (April 2024) to Revision H (November 2024)

  • 現在のファミリのフォーマットに合わせてドキュメント全体を変更Go
  • ドキュメントに M3 デバイスを追加Go
  • ドキュメント全体を通して、レガシーと新しいチップの項目表記を追加Go
  • ドキュメント全体にわたって表、図、相互参照の採番方法を更新Go
  • Added new chip curves to the Typical Characteristics sectionGo
  • Added Output Enable sectionGo
  • Added Dropout Voltage sectionGo
  • Changed Current Limit sectionGo
  • Added Undervoltage Lockout (UVLO) sectionGo
  • Added Thermal Shutdown sectionGo
  • Added Reverse Current sectionGo
  • Added Input and Output Capacitor Requirements sectionGo
  • Added Estimating Junction Temperature sectionGo
  • Added Power Dissipation (PD) sectionGo
  • Added Recommended Capacitor Types sectionGo
  • Added Feedback Resistor Selection sectionGo
  • Added Feedforward Capacitor sectionGo
  • Added Device Support and Documentation Support sectionsGo

Changes from Revision F (August 2023) to Revision G (April 2024)

  • 「特長」の AEC-Q100 の箇条書き項目に正しい温度グレード 1 の範囲を追加 Go
  • 「パッケージ情報」表と D パッケージのピン配置図の LP2591-50-Q1 を LP2951-50-Q1 に変更Go