4 Revision History
Changes from H Revision (April 2013) to I Revision
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Added Device Information and Pin Configuration and Functions sections, ESD Ratings table, update Thermal Values, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
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Deleted Lead Temp from Abs Max table (in POA); delete Heatsinking sections re: specific packages (outdated info) Go
Changes from G Revision (April 2013) to H Revision
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Changed layout of National Data Sheet to TI formatGo