The LP38690 and LP38692 low-dropout CMOS linear regulators provide tight output tolerance (2.5% typical), extremely low dropout voltage (450 mV at a 1-A load current, VOUT = 5 V), and excellent AC performance utilizing ultra low ESR ceramic output capacitors.
The low thermal resistance of the WSON, SOT-223, and TO-252 packages allow the full operating current to be used even in high ambient temperature environments.
The use of a PMOS power transistor means that no DC base drive current is required to bias it allowing ground pin current to remain below 100 µA regardless of load current, input voltage, or operating temperature.
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
---|---|---|
LP38690 | TO-252 (3) | 6.58 mm x 6.10 mm |
WSON (6) | 3.00 mm x 3.00 mm | |
LP38692 | SOT-223 (5) | 6.50 mm x 3.56 mm |
WSON (6) | 3.00 mm x 3.00 mm |
Changes from L Revision (March 2015) to M Revision
Changes from K Revision (December 2014) to L Revision
Changes from J Revision (April 2013) to K Revision
Changes from I Revision (April 2013) to J Revision
PIN | TYPE | DESCRIPTION | ||||
---|---|---|---|---|---|---|
NAME | LP38690 | LP38692 | ||||
TO-252 | WSON | SOT-223 | WSON | |||
EN | — | — | 1 | 3 | I | The Enable (EN) pin allows the part to be turned ON and OFF by pulling this pin HIGH or LOW. |
GND | TAB | 2 | 5 | 2 | — | Circuit ground for the regulator. For the TO-252 and SOT-223 packages this is thermally connected to the die and functions as a heat sink when soldered down to a large copper plane. |
IN | 3 | 1, 6 | 4 | 1, 6 | I | This is the input supply voltage to the regulator. For WSON devices, both IN pins must be tied together for full current operation (500 mA maximum per pin). |
OUT | 1 | 4 | 3 | 4 | O | Regulated output voltage. |
SNS | — | 5 | — | 5 | I | WSON only - Output sense pin allows remote sensing at the load which eliminates the error in output voltage due to voltage drops caused by the resistance in the traces between the regulator and the load. This pin must be tied to VOUT. |
DAP | — | X | — | X | — | WSON only - The DAP (Exposed Pad) functions as a thermal connection when soldered to a copper plane. See WSON Mounting section in Layout for more information. |
MIN | MAX | UNIT | ||
---|---|---|---|---|
V(max) All pins (with respect to GND) | –0.3 | 12 | V | |
IOUT(3) | Internally limited | |||
Junction temperature | −40 | 150 | °C | |
Lead temperature (soldering, 5 seconds) | 260 | |||
Power dissipation(2) | Internally limited | |||
Storage temperature, Tstg | –65 | 150 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
MIN | NOM | MAX | UNIT | ||
---|---|---|---|---|---|
VIN supply voltage | 2.7 | 10 | V | ||
Operating junction temperature | −40 | 125 | °C |
THERMAL METRIC(1) | LP38690 | LP38690/92 | LP38692 | UNIT | |
---|---|---|---|---|---|
TO-252 | WSON | SOT-223 | |||
3 PINS | 6 PINS | 5 PINS | |||
RθJA(2) | Junction-to-ambient thermal resistance | 50.5 | 50.6 | 68.5 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 52.6 | 44.4 | 52.2 | °C/W |
RθJB | Junction-to-board thermal resistance | 29.7 | 24.9 | 13.0 | °C/W |
ψJT | Junction-to-top characterization parameter | 4.8 | 0.4 | 5.5 | °C/W |
ψJB | Junction-to-board characterization parameter | 29.3 | 25.1 | 12.8 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.5 | 5.4 | n/a | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP(1) | MAX | UNIT | ||
---|---|---|---|---|---|---|---|
VOUT | Output voltage tolerance | –2.5 | 2.5 | %VOUT | |||
100 µA < IL < 1 A VO + 1 V ≤ VIN ≤ 10 V −40°C ≤ TJ ≤ 125°C |
–5 | 5 | |||||
ΔVOUT/ΔVIN | Output voltage line regulation(2) | VOUT + 0.5 V ≤ VIN ≤ 10 V IL = 25 mA |
0.03 | %/A | |||
VOUT + 0.5 V ≤ VIN ≤ 10 V IL = 25 mA −40°C ≤ TJ ≤ 125°C |
1 | ||||||
ΔVOUT/ΔIL | Output voltage load regulation(3) | 1 mA < IL < 1 A VIN = VOUT + 1 V |
1.8 | V | |||
1 mA < IL < 1 A VIN = VOUT + 1 V −40°C ≤ TJ ≤ 125°C |
5 | ||||||
VIN – VOUT | Dropout voltage(4) | VOUT = 1.8 V IL = 1 A |
950 | mV | |||
VOUT = 1.8 V IL = 1 A −40°C ≤ TJ ≤ 125°C |
1600 | ||||||
VOUT = 2.5 V | IL = 0.1 A | 80 | |||||
IL = 1 A | 800 | ||||||
VOUT = 2.5 V −40°C ≤ TJ ≤ 125°C |
IL = 0.1 A | 145 | |||||
IL = 1 A | 1300 | ||||||
VOUT = 3.3 V | IL = 0.1 A | 65 | |||||
IL = 1 A | 650 | ||||||
VOUT = 3.3 V −40°C ≤ TJ ≤ 125°C |
IL = 0.1 A | 110 | |||||
IL = 1 A | 1000 | ||||||
VOUT = 5 V | IL = 0.1 A | 45 | |||||
IL = 1 A | 450 | ||||||
VOUT = 5 V, −40°C ≤ TJ ≤ 125°C |
IL = 0.1 A | 100 | |||||
IL = 1 A | 800 | ||||||
IQ | Quiescent current | VIN ≤ 10 V, IL = 100 µA to 1 A | 55 | µA | |||
VIN ≤ 10 V, IL = 100 µA to 1 A −40°C ≤ TJ ≤ 125°C |
100 | ||||||
VEN ≤ 0.4 V (LP38692 only) | 0.001 | ||||||
IL(MIN) | Minimum load current | VIN – VOUT ≤ 4 V −40°C ≤ TJ ≤ 125°C |
100 | ||||
IFB | Foldback current limit | VIN – VOUT > 5 V | 450 | mA | |||
VIN – VOUT < 4 V | 1500 | ||||||
PSRR | Ripple rejection | VIN = VOUT + 2 V(DC), with 1V(p-p) / 120 Hz ripple | 55 | dB | |||
TSD | Thermal shutdown activation (junction temp) | 160 | °C | ||||
TSD (HYST) | Thermal shutdown hysteresis (junction temp) | 10 | |||||
en | Output noise | VOUT = 3.3 V, BW = 10 Hz to 10 kHz | 0.7 | µV/√Hz | |||
VOUT (LEAK) | Output leakage current | VOUT = VOUT(NOM) + 1 V at 10 VIN | 0.5 | 12 | µA | ||
VEN | Enable voltage (LP38692 only) | Output = OFF, −40°C ≤ TJ ≤ 125°C | 0.4 | V | |||
Output = ON, VIN = 4 V −40°C ≤ TJ ≤ 125°C |
1.8 | ||||||
Output = ON, VIN = 6 V −40°C ≤ TJ ≤ 125°C |
3 | ||||||
Output = ON, VIN = 10 V −40°C ≤ TJ ≤ 125°C |
4 | ||||||
IEN | Enable pin leakage | VEN = 0 V or 10 V, VIN = 10 V | –1 | 0.001 | 1 | µA |