SNVS185F February   2002  – April 2017 LP3982

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 No-Load Stability
      2. 7.3.2 Fast Start-Up
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Setting (ADJ Version Only)
        3. 8.2.2.3 Output Capacitance
        4. 8.2.2.4 Input Capacitor
        5. 8.2.2.5 Noise Bypass Capacitor
        6. 8.2.2.6 Fault Detection
        7. 8.2.2.7 Power Dissipation
        8. 8.2.2.8 Estimating Junction Temperature
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 WSON Mounting
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)(3)
MIN MAX UNIT
VIN, VOUT, VSHDN, VSET, VCC, VFAULT −0.3 6.5 V
Fault sink current 20 mA
Power dissipation See(4)
Junction temperature, TJ 150 °C
Storage temperature, Tstg –65 160 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pin.
(3) If Military/Aerospace-specified devices are required, contact Texas Instruments Sales Office/Distributors for availability and specifications.
(4) In applications where high power dissipation and/or poor thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA(MAX)) is dependant on the maximum operating junction temperature (TJ(MAX-OP)), the maximum power dissipation (PD(MAX)), and the junction-to-ambient thermal resistance in the application (RθJA). This relationship is given by: TA(MAX) = TJ(MAX-OP) − (PD(MAX) × RθJA).The value of the RθJA for the WSON package is specifically dependent on the PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to TI Application Note AN-1187 Leadless Leadframe Package (LLP) (SNOA401).

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Machine model ±200 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions(1)(2)

MIN NOM MAX UNIT
Operating temperature –40 85 °C
Supply voltage 2.5 6 V

6.4 Thermal Information

THERMAL METRIC(1) LP3982 UNIT
DGK (VSSOP) NGM (WSON)(2)
8 PINS 8 PINS
RθJA(3) Junction-to-ambient thermal resistance, High-K 175.2 52.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 66.0 66.2 °C/W
RθJB Junction-to-board thermal resistance 95.6 16.7 °C/W
ψJT Junction-to-top characterization parameter 9.7 1.9 °C/W
ψJB Junction-to-board characterization parameter 94.2 16.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a 11.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The PCB for the WSON/NGN package RθJA includes thermal vias under the exposed thermal pad per EIA/JEDEC JESD51-5.
(3) Thermal resistance value RθJA is based on the EIA/JEDEC High-K printed circuit board defined by: JESD51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.

6.5 Electrical Characteristics

Unless otherwise specified, all limits are specified for VIN = VOUT + 0.5 V(1), VSHDN = VIN, CIN = COUT = 2.2 μF, CCC = 33 nF, TJ = 25°C.
PARAMETER TEST CONDITIONS MIN(2) TYP(3) MAX(2) UNIT
VIN Input voltage For operating temperature extremes: −40°C to 85°C 2.5 6 V
ΔVOUT Output voltage tolerance 100 μA ≤ IOUT ≤ 300 mA
VIN = VOUT + 0.5 V(1)
SET = OUT for the ADJ Versions		 −2 2 % of VOUT (NOM)
For operating temperature extremes: −40°C to 85°C −3 3
VOUT Output adjust range ADJ version only;
for operating temperature extremes: −40°C to 85°C		 1.25 6 V
IOUT Maximum output current Average DC current rating;
For operating temperature extremes: −40°C and 85°C		 300 mA
ILIMIT Output current limit 770 mA
For operating temperature extremes: −40°C to 85°C 330
IQ Supply current IOUT = 0 mA 90 μA
IOUT = 0 mA;
for operating temperature extremes: −40°C to 85°C		 270
IOUT = 300 mA 225
Shutdown supply current VO = 0 V, SHDN = GND 0.001 1 μA
VDO Dropout voltage(1)(4) IOUT = 1 mA 0.4 mV
IOUT = 200 mA 80
IOUT = 200 mA;
for operating temperature extremes: −40°C to 85°C		 220
IOUT = 300 mA 120
ΔVOUT Line regulation IOUT = 1 mA,
(VOUT + 0.5 V) ≤ VI ≤ 6 V(1)		 0.01 %/V
IOUT = 1 mA, (VOUT + 0.5 V) ≤ VI ≤ 6 V(1);
for operating temperature extremes: −40°C to 85°C		 −0.1 0.1
Load regulation 100 μA ≤ IOUT ≤ 300 mA 0.002 %/mA
en Output voltage noise IOUT = 10 mA, 10 Hz ≤ f ≤ 100 kHz 37 μVRMS
Output voltage noise density 10 Hz ≤ f ≤ 100 kHz, COUT = 10 μF 190 nV/√Hz
VSHDN SHDN input threshold VIH, (VOUT + 0.5 V) ≤ VIN ≤ 6 V(1);
for operating temperature extremes: −40°C to 85°C		 2 V
VIL, (VOUT + 0.5 V) ≤ VIN ≤ 6 V(1);
for operating temperature extremes:−40°C to 85°C		 0.4
ISHDN SHDN input bias current SHDN = GND or IN 0.1 100 nA
ISET SET input leakage SET = 1.3 V, ADJ version only(5) 0.1 2.5 nA
VFAULT FAULT detection voltage VO ≥ 2.5 V, IOUT = 200 mA(6) 120 mV
VOUT ≥ 2.5 V, IOUT = 200 mA(6);
for operating temperature extremes: −40°C to 85°C		 280
FAULT output low voltage ISINK = 2 mA 0.115 V
ISINK = 2 mA;
for operating temperature extremes: −40°C to 85°C		 0.25
IFAULT FAULT off-leakage current FAULT = 3.6 V, SHDN = 0 V 0.1 100 nA
TSD Thermal shutdown temperature 160 °C
Thermal shutdown hysteresis 10
TON Start-up time COUT = 10 μF, VOUT at 90% of final value 120 μs
(1) Condition does not apply to input voltages below 2.5 V because this is the minimum input operating voltage.
(2) All limits are verified by testing or statistical analysis.
(3) Typical values represent the most likely parametric norm.
(4) Dropout voltage is measured by reducing VIN until VOUT drops 100 mV from its nominal value at VIN – VOUT = 0.5 V. Dropout voltage does not apply to the 1.8-V version.
(5) The SET pin is not externally connected for the fixed versions.
(6) The FAULT detection voltage is specified for the input-to-output voltage differential at which the FAULT pin goes active low.

6.6 Typical Characteristics

Unless otherwise specified, VIN = VO + 0.5 V, CIN = COUT = 2.2 μF, CCC = 33 nF, TJ = 25°C, VSHDN = VIN.
LP3982 20036903.gif Figure 1. Dropout Voltage vs Load Current
(for Different Output Voltages)
LP3982 20036928.gif Figure 3. FAULT Detect Threshold vs Load Current
LP3982 20036930.gif Figure 5. Supply Current vs Load Current
LP3982 20036905.gif Figure 7. Output Noise Spectral Density
LP3982 20036907.gif Figure 9. Output Impedance vs Frequency
LP3982 20036911.gif Figure 11. Power-Up Response
LP3982 20036927.gif Figure 2. Dropout Voltage vs Load Current
(for Different Output Temperatures)
LP3982 20036929.gif Figure 4. Supply Current vs Input Voltage
LP3982 20036904.gif Figure 6. Power Supply Rejection Ratio vs Frequency
LP3982 20036906.gif Figure 8. Output Noise (10 Hz to 100 kHz)
LP3982 20036910.gif Figure 10. Shutdown Response
LP3982 20036912.gif Figure 12. Power-Down Response