SNVS458D June   2007  – October 2016 LP55281

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 I2C Timing Requirements
    8. 6.8 Boost Converter Typical Characteristics
    9. 6.9 RGB Driver Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Magnetic Boost DC-DC Converter
        1. 7.3.1.1 Boost Standby Mode
        2. 7.3.1.2 Boost Output Voltage Control
        3. 7.3.1.3 Boost Frequency Control
      2. 7.3.2 Functionality of RGB LED Outputs (R1-4, G1-4, B1-4)
        1. 7.3.2.1 PWM Control Timing
      3. 7.3.3 Audio Synchronization
        1. 7.3.3.1 Control of Audio Synchronization
        2. 7.3.3.2 ALED Driver
          1. 7.3.3.2.1 Adjustment of ALED Driver
      4. 7.3.4 LED Test Interface
        1. 7.3.4.1 LED Test Procedure
        2. 7.3.4.2 LED Test Time Estimation
      5. 7.3.5 7-V Shielding
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes Of Operation
    5. 7.5 Programming
      1. 7.5.1 SPI Interface
      2. 7.5.2 I2C Compatible Serial Bus Interface
        1. 7.5.2.1 Interface Bus Overview
        2. 7.5.2.2 Data Transactions
        3. 7.5.2.3 Acknowledge Cycle
        4. 7.5.2.4 Acknowledge After Every Byte Rule
        5. 7.5.2.5 Addressing Transfer Formats
        6. 7.5.2.6 Control Register Write Cycle
        7. 7.5.2.7 Control Register Read Cycle
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Recommended External Components
          1. 8.2.2.1.1 Output Capacitor, COUT
          2. 8.2.2.1.2 List Of Recommended External Components
          3. 8.2.2.1.3 Input Capacitor, CIN
          4. 8.2.2.1.4 Output Diode, D1
          5. 8.2.2.1.5 Inductor, L
      3. 8.2.3 Application Curves
    3. 8.3 Initialization Set Up Example
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Boost Output Capacitor Placement
      2. 10.1.2 Schottky Diode Placement
      3. 10.1.3 Inductor Placement
      4. 10.1.4 Boost Input Capacitor Placement
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

4 Revision History

Changes from C Revision (March 2013) to D Revision

  • Added Device Information and Pin Configuration and Functions sections, ESD Ratings and Thermal Information tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections; update titleGo
  • Added NRST pin connection to MCU on Simplified Schematic Go
  • Changed RθJA for YPG package from "60°C/W" to "48.9°C/W"and for YZR package from "60°C/W" to "49.1°C/W"Go

Changes from B Revision (March 2013) to C Revision

  • Changed layout of National Semiconductor data sheet to TI formatGo