4 Revision History
Changes from E Revision (May 2013) to F Revision
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Added Device Information and Pin Configuration and Functions sections, ESD Ratings and Thermal Information tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections; update pin names to TI nomenclatureGo
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Deleted lead temp spec - it is in POA Go
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Updated thermal information Go
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Changed values for thermal specifications in Power Dissipation section per updated thermal information Go
Changes from D Revision (April 2013) to E Revision
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Changed layout of National Data Sheet to TI formatGo