JAJSLV6 データシート

JAJSLV6 April 2021 LP8758-EA

PRODUCTION DATA

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）

YFF|35
- MXBG315

サーマルパッド・メカニカル・データ

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted).⁽¹⁾⁽²⁾

		MIN	MAX	UNIT
INPUT VOLTAGE
VIN_Bx, VANA	Voltage on power connections	–0.3	6	V
SW_Bx	Voltage on buck switch nodes	–0.3	(VIN_Bx + 0.3 V) with 6 V maximum	V
FB_Bx	Voltage on buck voltage sense nodes	–0.3	(VANA + 0.3 V) with 6 V maximum	V
NRST	Voltage on NRST input	–0.3	3.6	V
ENx, SDA, SCL, nINT	Voltage on logic pins (input or output pins)	–0.3	3.6	V
CURRENT
VIN_Bx, SW_Bx, PGND_Bx	Current on power pins (average current over 100k hour lifetime, T_J = 125°C)		0.62	A/pin
TEMPERATURE
T_J-MAX	Junction temperature	−40	150	°C
Maximum lead temperature (soldering, 10 seconds)⁽³⁾			260	°C
T_stg	Storage temperature	–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Section 6.3. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to network ground.

(3) For detailed soldering specifications and information, please refer to DSBGA Wafer Level Chip Scale Package.