JAJSJP4A August   2017  – September 2020 LV14360

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Fixed Frequency Peak Current Mode Control
      2. 8.3.2  Slope Compensation
      3. 8.3.3  Sleep Mode
      4. 8.3.4  Low Dropout Operation and Bootstrap Voltage (BOOT)
      5. 8.3.5  Adjustable Output Voltage
      6. 8.3.6  Enable and Adjustable Undervoltage Lockout
      7. 8.3.7  External Soft Start
      8. 8.3.8  Switching Frequency and Synchronization (RT/SYNC)
      9. 8.3.9  Power Good (PGOOD)
      10. 8.3.10 Overcurrent and Short-Circuit Protection
      11. 8.3.11 Overvoltage Protection
      12. 8.3.12 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Active Mode
      3. 8.4.3 CCM Mode
      4. 8.4.4 Light Load Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Voltage Set-Point
        2. 9.2.2.2 Switching Frequency
        3. 9.2.2.3 Output Inductor Selection
        4. 9.2.2.4 Output Capacitor Selection
        5. 9.2.2.5 Schottky Diode Selection
        6. 9.2.2.6 Input Capacitor Selection
        7. 9.2.2.7 Bootstrap Capacitor Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 ドキュメントの更新通知を受け取る方法
    2. 12.2 サポート・リソース
    3. 12.3 Trademarks
    4. 12.4 用語集
    5. 12.5 静電気放電に関する注意事項
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4 Thermal Information

THERMAL METRIC (1) (2)LV14360UNIT
DDA (HSOIC)
8 PINS
RθJAJunction-to-ambient thermal resistance42.5°C/W
ψJTJunction-to-top characterization parameter9.9°C/W
ψJBJunction-to-board characterization parameter25.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance56.1°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance3.8°C/W
RθJBJunction-to-board thermal resistance25.5°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Power rating at a specific ambient temperature TA should be determined with a maximum junction temperature (TJ) of 125°C (see Section 7.3).