JAJSJP4A August 2017 – September 2020 LV14360
PRODUCTION DATA
PIN | TYPE (1) | DESCRIPTION | |
---|---|---|---|
NO. | NAME | ||
1 | BOOT | P | Bootstrap capacitor connection for high-side MOSFET driver. Connect a high quality 0.1-μF capacitor from BOOT to SW. |
2 | VIN | P | Connect to power supply and bypass capacitors CIN. Path from VIN pin to high frequency bypass CIN and GND must be as short as possible. |
3 | EN | A | Enable pin with internal pullup current source. Pull below 1.2 V to disable. Float or connect to VIN to enable. Adjust the input undervoltage lockout with two resistors (see Section 8.3.6). |
4 | RT/SYNC | A | Resistor timing or external clock input. An internal amplifier holds this pin at a fixed voltage when using an external resistor to ground to set the switching frequency. If the pin is pulled above the PLL upper threshold, a mode change occurs and the pin becomes a synchronization input. The internal amplifier is disabled and the pin is a high impedance clock input to the internal PLL. If clocking edges stop, the internal amplifier is re-enabled, and the operating mode returns to frequency programming by resistor. |
5 | FB | A | Feedback input pin, connect to the feedback divider to set VOUT. Do not short this pin to ground during operation. |
6 | SS or PGOOD | A | SS pin for soft-start version, connect to a capacitor to set soft-start time. The PGOOD pin for power-good version, open-drain output for power-good flag, use a 10-kΩ to 100-kΩ pullup resistor to logic rail or other DC voltage no higher than 7 V. |
7 | GND | G | System ground pin |
8 | SW | P | Switching output of the regulator. Internally connected to high-side power MOSFET. Connect to power inductor. |
9 | Thermal Pad | G | Major heat dissipation path of the die. Must be connected to ground plane on PCB. |