JAJSPY3
August 2023
LV5144
PRODUCTION DATA
1
1
特長
2
アプリケーション
3
概要
4
Revision History
5
概要 (続き)
6
Pin Configuration and Functions
6.1
Wettable Flanks
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Input Range (VIN)
8.3.2
Output Voltage Setpoint and Accuracy (FB)
8.3.3
High-Voltage Bias Supply Regulator (VCC)
8.3.4
Precision Enable (EN/UVLO)
8.3.5
Power Good Monitor (PGOOD)
8.3.6
Switching Frequency (RT, SYNCIN)
8.3.6.1
Frequency Adjust
8.3.6.2
Clock Synchronization
8.3.7
Configurable Soft Start (SS/TRK)
8.3.7.1
Tracking
8.3.8
Voltage-Mode Control (COMP)
8.3.9
Gate Drivers (LO, HO)
8.3.10
Current Sensing and Overcurrent Protection (ILIM)
8.3.11
OCP Duty Cycle Limiter
8.4
Device Functional Modes
8.4.1
Shutdown Mode
8.4.2
Standby Mode
8.4.3
Active Mode
8.4.4
Diode Emulation Mode
8.4.5
Thermal Shutdown
9
Application and Implementation
9.1
Application Information
9.1.1
Design and Implementation
9.1.2
Power Train Components
9.1.2.1
Inductor
9.1.2.2
Output Capacitors
9.1.2.3
Input Capacitors
9.1.2.4
Power MOSFETs
9.1.3
Control Loop Compensation
9.1.4
EMI Filter Design
9.2
Typical Applications
9.2.1
Design 1 – 12-A High-Efficiency Synchronous Buck DC/DC Regulator
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.3
Application Curves
9.2.2
Design 2 – High Density, 12-V, 8-A Rail From 48-V Telecom Power
9.2.2.1
Design Requirements
9.2.2.2
Detailed Design Procedure
9.2.2.3
Application Curves
9.3
Power Supply Recommendations
9.4
Layout
9.4.1
Layout Guidelines
9.4.1.1
Power Stage Layout
9.4.1.2
Gate Drive Layout
9.4.1.3
PWM Controller Layout
9.4.1.4
Thermal Design and Layout
9.4.1.5
Ground Plane Design
9.4.2
Layout Example
10
Device and Documentation Support
10.1
Device Support
10.1.1
サード・パーティ製品に関する免責事項
10.1.2
Development Support
10.2
Documentation Support
10.2.1
Related Documentation
10.2.1.1
PCB Layout Resources
10.2.1.2
Thermal Design Resources
10.3
ドキュメントの更新通知を受け取る方法
10.4
サポート・リソース
10.5
Trademarks
10.6
静電気放電に関する注意事項
10.7
用語集
11
Mechanical, Packaging, and Orderable Information
パッケージ・オプション
メカニカル・データ(パッケージ|ピン)
RGY|20
MPQF116H
サーマルパッド・メカニカル・データ
RGY|20
QFND755
発注情報
jajspy3_oa
10.2.1.2
Thermal Design Resources
Texas Instruments,
AN-2020 Thermal Design by Insight, Not Hindsight
application note
Texas Instruments,
AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages
application note
Texas Instruments,
Semiconductor and IC Package Thermal Metrics
application note
Texas Instruments,
Thermal Design Made Simple with LM43603 and LM43602
application note
Texas Instruments,
PowerPAD™
Thermally Enhanced Package
application note
Texas Instruments,
PowerPAD Made Easy
application brief
Texas Instruments,
Using New Thermal Metrics
application note