JAJSSD0 データシート

JAJSSD0B January 2006 – December 2023 MAX3223E

PRODUCTION DATA

4.5 Thermal Information

THERMAL METRIC⁽¹⁾		DB (SOIC)	DW (SOIC)	PW (TSSOP)	UNIT
THERMAL METRIC⁽¹⁾		20 PINS	20 PINS	20 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance	87.2	76.8	89.7	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	41.1	39.6	29.0	°C/W
R_θJB	Junction-to-board thermal resistance	43.3	41.5	41.9	°C/W
ψ_JT	Junction-to-top characterization parameter	9.2	12.6	1.9	°C/W
ψ_JB	Junction-to-board characterization parameter	42.7	40.9	41.3	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.