JAJSNS6A december   2022  – april 2023 MCF8315A

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Characteristics of the SDA and SCL bus for Standard and Fast mode
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Output Stage
      2. 7.3.2  Device Interface
        1. 7.3.2.1 Interface - Control and Monitoring
        2. 7.3.2.2 I2C Interface
      3. 7.3.3  Step-Down Mixed-Mode Buck Regulator
        1. 7.3.3.1 Buck in Inductor Mode
        2. 7.3.3.2 Buck in Resistor mode
        3. 7.3.3.3 Buck Regulator with External LDO
        4. 7.3.3.4 AVDD Power Sequencing from Buck Regulator
        5. 7.3.3.5 Mixed Mode Buck Operation and Control
        6. 7.3.3.6 Buck Under Voltage Protection
        7. 7.3.3.7 Buck Over Current Protection
      4. 7.3.4  AVDD Linear Voltage Regulator
      5. 7.3.5  Charge Pump
      6. 7.3.6  Slew Rate Control
      7. 7.3.7  Cross Conduction (Dead Time)
      8. 7.3.8  Speed Control
        1. 7.3.8.1 Analog Mode Speed Control
        2. 7.3.8.2 PWM Mode Speed Control
        3. 7.3.8.3 I2C based Speed Control
        4. 7.3.8.4 Frequency Mode Speed Control
        5. 7.3.8.5 Speed Profiles
          1. 7.3.8.5.1 Linear Speed Profiles
          2. 7.3.8.5.2 Staircase Speed Profile
          3. 7.3.8.5.3 Forward-Reverse Speed Profile
      9. 7.3.9  Starting the Motor Under Different Initial Conditions
        1. 7.3.9.1 Case 1 – Motor is Stationary
        2. 7.3.9.2 Case 2 – Motor is Spinning in the Forward Direction
        3. 7.3.9.3 Case 3 – Motor is Spinning in the Reverse Direction
      10. 7.3.10 Motor Start Sequence (MSS)
        1. 7.3.10.1 Initial Speed Detect (ISD)
        2. 7.3.10.2 Motor Resynchronization
        3. 7.3.10.3 Reverse Drive
          1. 7.3.10.3.1 Reverse Drive Tuning
        4. 7.3.10.4 Motor Start-up
          1. 7.3.10.4.1 Align
          2. 7.3.10.4.2 Double Align
          3. 7.3.10.4.3 Initial Position Detection (IPD)
            1. 7.3.10.4.3.1 IPD Operation
            2. 7.3.10.4.3.2 IPD Release Mode
            3. 7.3.10.4.3.3 IPD Advance Angle
          4. 7.3.10.4.4 Slow First Cycle Startup
          5. 7.3.10.4.5 Open loop
          6. 7.3.10.4.6 Transition from Open to Closed Loop
      11. 7.3.11 Closed Loop Operation
        1. 7.3.11.1 Closed loop accelerate
        2. 7.3.11.2 Speed PI Control
        3. 7.3.11.3 Current PI Control
        4. 7.3.11.4 Overmodulation
      12. 7.3.12 Motor Parameters
        1. 7.3.12.1 Motor Resistance
        2. 7.3.12.2 Motor Inductance
        3. 7.3.12.3 Motor Back-EMF constant
      13. 7.3.13 Motor Parameter Extraction Tool (MPET)
      14. 7.3.14 Anti-Voltage Surge (AVS)
      15. 7.3.15 Output PWM Switching Frequency
      16. 7.3.16 Active Braking
      17. 7.3.17 PWM Modulation Schemes
      18. 7.3.18 Dead Time Compensation
      19. 7.3.19 Motor Stop Options
        1. 7.3.19.1 Coast (Hi-Z) Mode
        2. 7.3.19.2 Recirculation Mode
        3. 7.3.19.3 Low-Side Braking
        4. 7.3.19.4 High-Side Braking
        5. 7.3.19.5 Active Spin-Down
        6. 7.3.19.6 Align Braking
      20. 7.3.20 FG Configuration
        1. 7.3.20.1 FG Output Frequency
        2. 7.3.20.2 FG Open-Loop and Lock Behavior
      21. 7.3.21 DC Bus Current Limit
      22. 7.3.22 Protections
        1. 7.3.22.1  VM Supply Undervoltage Lockout
        2. 7.3.22.2  AVDD Undervoltage Lockout (AVDD_UV)
        3. 7.3.22.3  BUCK Undervoltage Lockout (BUCK_UV)
        4. 7.3.22.4  VCP Charge Pump Undervoltage Lockout (CPUV)
        5. 7.3.22.5  Overvoltage Protection (OVP)
        6. 7.3.22.6  Overcurrent Protection (OCP)
          1. 7.3.22.6.1 OCP Latched Shutdown (OCP_MODE = 00b)
          2. 7.3.22.6.2 OCP Automatic Retry (OCP_MODE = 01b)
          3. 7.3.22.6.3 OCP Report Only (OCP_MODE = 10b)
          4. 7.3.22.6.4 OCP Disabled (OCP_MODE = 11b)
        7. 7.3.22.7  Buck Overcurrent Protection
        8. 7.3.22.8  Hardware Lock Detection Current Limit (HW_LOCK_ILIMIT)
          1. 7.3.22.8.1 HW_LOCK_ILIMIT Latched Shutdown (HW_LOCK_ILIMIT_MODE = 00xxb)
          2. 7.3.22.8.2 HW_LOCK_ILIMIT Automatic recovery (HW_LOCK_ILIMIT_MODE = 01xxb)
          3. 7.3.22.8.3 HW_LOCK_ILIMIT Report Only (HW_LOCK_ILIMIT_MODE = 1000b)
          4. 7.3.22.8.4 HW_LOCK_ILIMIT Disabled (HW_LOCK_ILIMIT_MODE= 1xx1b)
        9. 7.3.22.9  Thermal Warning (OTW)
        10. 7.3.22.10 Thermal Shutdown (TSD)
        11. 7.3.22.11 Motor Lock (MTR_LCK)
          1. 7.3.22.11.1 MTR_LCK Latched Shutdown (MTR_LCK_MODE = 00xxb)
          2. 7.3.22.11.2 MTR_LCK Automatic Recovery (MTR_LCK_MODE= 01xxb)
          3. 7.3.22.11.3 MTR_LCK Report Only (MTR_LCK_MODE = 1000b)
          4. 7.3.22.11.4 MTR_LCK Disabled (MTR_LCK_MODE = 1xx1b)
        12. 7.3.22.12 Motor Lock Detection
          1. 7.3.22.12.1 Lock 1: Abnormal Speed (ABN_SPEED)
          2. 7.3.22.12.2 Lock 2: Abnormal BEMF (ABN_BEMF)
          3. 7.3.22.12.3 Lock3: No-Motor Fault (NO_MTR)
        13. 7.3.22.13 MPET Faults
        14. 7.3.22.14 IPD Faults
    4. 7.4 Device Functional Modes
      1. 7.4.1 Functional Modes
        1. 7.4.1.1 Sleep Mode
        2. 7.4.1.2 Standby Mode
        3. 7.4.1.3 Fault Reset (CLR_FLT)
    5. 7.5 External Interface
      1. 7.5.1 DRVOFF Functionality
      2. 7.5.2 DAC outputs
      3. 7.5.3 Current Sense Output
      4. 7.5.4 Oscillator Source
        1. 7.5.4.1 External Clock Source
      5. 7.5.5 External Watchdog
    6. 7.6 EEPROM access and I2C interface
      1. 7.6.1 EEPROM Access
        1. 7.6.1.1 EEPROM Write
        2. 7.6.1.2 EEPROM Read
      2. 7.6.2 I2C Serial Interface
        1. 7.6.2.1 I2C Data Word
        2. 7.6.2.2 I2C Write Transaction
        3. 7.6.2.3 I2C Read Transaction
        4. 7.6.2.4 I2C Communication Protocol Packet Examples
        5. 7.6.2.5 I2C Clock Stretching
        6. 7.6.2.6 CRC Byte Calculation
    7. 7.7 EEPROM (Non-Volatile) Register Map
      1. 7.7.1 Algorithm_Configuration Registers
      2. 7.7.2 Fault_Configuration Registers
      3. 7.7.3 Hardware_Configuration Registers
      4. 7.7.4 Internal_Algorithm_Configuration Registers
    8. 7.8 RAM (Volatile) Register Map
      1. 7.8.1 Fault_Status Registers
      2. 7.8.2 System_Status Registers
      3. 7.8.3 Device_Control Registers
      4. 7.8.4 Algorithm_Control Registers
      5. 7.8.5 Algorithm_Variables Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Speed Input before VM Power-up
      2. 8.2.2 Application Curves
        1. 8.2.2.1 Motor startup
        2. 8.2.2.2 MPET
        3. 8.2.2.3 Dead time compensation
        4. 8.2.2.4 Auto handoff
        5. 8.2.2.5 Motor stop – recirculation mode
        6. 8.2.2.6 Anti voltage surge (AVS)
        7. 8.2.2.7 Real time variable tracking using DACOUT
  10. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Power Dissipation
  12. 11Device and Documentation Support
    1. 11.1 サポート・リソース
    2. 11.2 Trademarks
    3. 11.3 静電気放電に関する注意事項
    4. 11.4 用語集
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.1 Layout Guidelines

The bulk capacitor should be placed to minimize the distance of the high-current path through the motor driver device. The connecting metal trace widths should be as wide as possible, and numerous vias should be used when connecting PCB layers. These practices minimize parasitic inductance and allow the bulk capacitor to deliver high current.

Small-value capacitors should be ceramic, and placed closely to device pins.

The high-current device outputs should use wide metal traces.

To reduce noise coupling and EMI interference from large transient currents into small-current signal paths, grounding should be partitioned between PGND and AGND. TI recommends connecting all non-power stage circuitry (including the thermal pad) to AGND to reduce parasitic effects and improve power dissipation from the device. Optionally, GND_BK can be split. Ensure grounds are connected through net-ties or wide resistors to reduce voltage offsets and maintain gate driver performance.

The device thermal pad should be soldered to the PCB top-layer ground plane. Multiple vias should be used to connect to a large bottom-layer ground plane. The use of large metal planes and multiple vias helps dissipate the I2 × RDS(on) heat that is generated in the device.

To improve thermal performance, maximize the ground area that is connected to the thermal pad ground across all possible layers of the PCB. Using thick copper pours can lower the junction-to-air thermal resistance and improve thermal dissipation from the die surface.

Separate the SW_BK and FB_BK traces with ground separation to reduce buck switching from coupling as noise into the buck outer feedback loop. Widen the FB_BK trace as much as possible to allow for faster load switching.

Figure 10-1 shows a layout example for the MCF8315A. Also, for layout example, refer to MCF8315A EVM.