JAJSST7A January   2024  – May 2024 MCF8315C-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings Auto
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Characteristics of the SDA and SCL bus for Standard and Fast mode
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Output Stage
      2. 6.3.2  Device Interface
        1. 6.3.2.1 Interface - Control and Monitoring
        2. 6.3.2.2 I2C Interface
      3. 6.3.3  Step-Down Mixed-Mode Buck Regulator
        1. 6.3.3.1 Buck in Inductor Mode
        2. 6.3.3.2 Buck in Resistor mode
        3. 6.3.3.3 Buck Regulator with External LDO
        4. 6.3.3.4 AVDD Power Sequencing from Buck Regulator
        5. 6.3.3.5 Mixed Mode Buck Operation and Control
        6. 6.3.3.6 Buck Under Voltage Protection
        7. 6.3.3.7 Buck Over Current Protection
      4. 6.3.4  AVDD Linear Voltage Regulator
      5. 6.3.5  Charge Pump
      6. 6.3.6  Slew Rate Control
      7. 6.3.7  Cross Conduction (Dead Time)
      8. 6.3.8  Motor Control Input Sources
        1. 6.3.8.1 Analog Mode Motor Control
        2. 6.3.8.2 PWM Mode Motor Control
        3. 6.3.8.3 I2C based Motor Control
        4. 6.3.8.4 Frequency Mode Motor Control
        5. 6.3.8.5 Speed Profiles
          1. 6.3.8.5.1 Linear Reference Profiles
          2. 6.3.8.5.2 Staircase Reference Profiles
          3. 6.3.8.5.3 Forward-Reverse Reference Profiles
      9. 6.3.9  Starting the Motor Under Different Initial Conditions
        1. 6.3.9.1 Case 1 – Motor is Stationary
        2. 6.3.9.2 Case 2 – Motor is Spinning in the Forward Direction
        3. 6.3.9.3 Case 3 – Motor is Spinning in the Reverse Direction
      10. 6.3.10 Motor Start Sequence (MSS)
        1. 6.3.10.1 Initial Speed Detect (ISD)
        2. 6.3.10.2 Motor Resynchronization
        3. 6.3.10.3 Reverse Drive
          1. 6.3.10.3.1 Reverse Drive Tuning
      11. 6.3.11 Motor Start-up
        1. 6.3.11.1 Align
        2. 6.3.11.2 Double Align
        3. 6.3.11.3 Initial Position Detection (IPD)
          1. 6.3.11.3.1 IPD Operation
          2. 6.3.11.3.2 IPD Release Mode
          3. 6.3.11.3.3 IPD Advance Angle
        4. 6.3.11.4 Slow First Cycle Start-up
        5. 6.3.11.5 Open loop
        6. 6.3.11.6 Transition from Open to Closed Loop
      12. 6.3.12 Closed Loop Operation
        1. 6.3.12.1 Closed Loop Acceleration/Deceleration Slew Rate
        2. 6.3.12.2 Speed PI Control
        3. 6.3.12.3 Current PI Control
        4. 6.3.12.4 Torque Mode
        5. 6.3.12.5 Overmodulation
      13. 6.3.13 Motor Parameters
        1. 6.3.13.1 Motor Resistance
        2. 6.3.13.2 Motor Inductance
        3. 6.3.13.3 Motor Back-EMF constant
      14. 6.3.14 Motor Parameter Extraction Tool (MPET)
      15. 6.3.15 Anti-Voltage Surge (AVS)
      16. 6.3.16 Active Braking
      17. 6.3.17 Output PWM Switching Frequency
      18. 6.3.18 PWM Modulation Schemes
      19. 6.3.19 Dead Time Compensation
      20. 6.3.20 Motor Stop Options
        1. 6.3.20.1 Coast (Hi-Z) Mode
        2. 6.3.20.2 Low-Side Braking
        3. 6.3.20.3 Active Spin-Down
      21. 6.3.21 FG Configuration
        1. 6.3.21.1 FG Output Frequency
        2. 6.3.21.2 FG during open loop
        3. 6.3.21.3 FG during idle and fault
      22. 6.3.22 DC Bus Current Limit
      23. 6.3.23 Protections
        1. 6.3.23.1  VM Supply Undervoltage Lockout
        2. 6.3.23.2  AVDD Undervoltage Lockout (AVDD_UV)
        3. 6.3.23.3  BUCK Under Voltage Lockout (BUCK_UV)
        4. 6.3.23.4  VCP Charge Pump Undervoltage Lockout (CPUV)
        5. 6.3.23.5  Overvoltage Protection (OVP)
        6. 6.3.23.6  Overcurrent Protection (OCP)
          1. 6.3.23.6.1 OCP Latched Shutdown (OCP_MODE = 00b)
          2. 6.3.23.6.2 OCP Automatic Retry (OCP_MODE = 01b)
        7. 6.3.23.7  Buck Overcurrent Protection
        8. 6.3.23.8  Hardware Lock Detection Current Limit (HW_LOCK_ILIMIT)
          1. 6.3.23.8.1 HW_LOCK_ILIMIT Latched Shutdown (HW_LOCK_ILIMIT_MODE = 00xxb)
          2. 6.3.23.8.2 HW_LOCK_ILIMIT Automatic recovery (HW_LOCK_ILIMIT_MODE = 01xxb)
          3. 6.3.23.8.3 HW_LOCK_ILIMIT Report Only (HW_LOCK_ILIMIT_MODE = 1000b)
          4. 6.3.23.8.4 HW_LOCK_ILIMIT Disabled (HW_LOCK_ILIMIT_MODE= 1xx1b)
        9. 6.3.23.9  Motor Lock (MTR_LCK)
          1. 6.3.23.9.1 MTR_LCK Latched Shutdown (MTR_LCK_MODE = 00xxb)
          2. 6.3.23.9.2 MTR_LCK Automatic Recovery (MTR_LCK_MODE= 01xxb)
          3. 6.3.23.9.3 MTR_LCK Report Only (MTR_LCK_MODE = 1000b)
          4. 6.3.23.9.4 MTR_LCK Disabled (MTR_LCK_MODE = 1xx1b)
        10. 6.3.23.10 Motor Lock Detection
          1. 6.3.23.10.1 Lock 1: Abnormal Speed (ABN_SPEED)
          2. 6.3.23.10.2 Lock 2: Abnormal BEMF (ABN_BEMF)
          3. 6.3.23.10.3 Lock3: No-Motor Fault (NO_MTR)
        11. 6.3.23.11 Minimum VM (undervoltage) Protection
        12. 6.3.23.12 Maximum VM (overvoltage) Protection
        13. 6.3.23.13 MPET Faults
        14. 6.3.23.14 IPD Faults
        15. 6.3.23.15 Thermal Warning (OTW)
        16. 6.3.23.16 Thermal Shutdown (TSD)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Functional Modes
        1. 6.4.1.1 Sleep Mode
        2. 6.4.1.2 Standby Mode
        3. 6.4.1.3 Fault Reset (CLR_FLT)
    5. 6.5 External Interface
      1. 6.5.1 DRVOFF Functionality
      2. 6.5.2 DAC output(s)
      3. 6.5.3 Current Sense Output
      4. 6.5.4 Oscillator Source
        1. 6.5.4.1 External Clock Source
      5. 6.5.5 External Watchdog
    6. 6.6 EEPROM access and I2C interface
      1. 6.6.1 EEPROM Access
        1. 6.6.1.1 EEPROM Write
        2. 6.6.1.2 EEPROM Read
      2. 6.6.2 I2C Serial Interface
        1. 6.6.2.1 I2C Data Word
        2. 6.6.2.2 I2C Write Transaction
        3. 6.6.2.3 I2C Read Transaction
        4. 6.6.2.4 I2C Communication Protocol Packet Examples
        5. 6.6.2.5 I2C Clock Stretching
        6. 6.6.2.6 CRC Byte Calculation
  8. 7 EEPROM (Non-Volatile) Register Map
    1. 7.1 Algorithm_Configuration Registers
    2. 7.2 Fault_Configuration Registers
    3. 7.3 Hardware_Configuration Registers
    4. 7.4 Internal_Algorithm_Configuration Registers
  9. 8 RAM (Volatile) Register Map
    1. 8.1 Fault_Status Registers
    2. 8.2 System_Status Registers
    3. 8.3 Device_Control Registers
    4. 8.4 Algorithm_Control Registers
    5. 8.5 Algorithm_Variables Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Application Curves
        1. 9.2.1.1 Motor startup
        2. 9.2.1.2 MPET
        3. 9.2.1.3 Dead time compensation
        4. 9.2.1.4 Auto handoff
        5. 9.2.1.5 Anti voltage surge (AVS)
        6. 9.2.1.6 Real time variable tracking using DACOUT
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Bulk Capacitance
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Thermal Considerations
        1. 9.4.2.1 Power Dissipation
  11. 10Device and Documentation Support
    1. 10.1 サポート・リソース
    2. 10.2 Trademarks
    3. 10.3 静電気放電に関する注意事項
    4. 10.4 用語集
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

9.4.1 Layout Guidelines

The bulk capacitor should be placed to minimize the distance of the high-current path through the motor driver device. The connecting metal trace widths should be as wide as possible, and numerous vias should be used when connecting PCB layers. These practices minimize parasitic inductance and allow the bulk capacitor to deliver high current.

Small-value capacitors should be ceramic, and placed closely to device pins.

The high-current device outputs should use wide metal traces.

To reduce noise coupling and EMI interference from large transient currents into small-current signal paths, grounding should be partitioned between PGND and AGND. TI recommends connecting all non-power stage circuitry (including the thermal pad) to AGND to reduce parasitic effects and improve power dissipation from the device. Optionally, GND_BK can be split. Ensure grounds are connected through net-ties or wide resistors to reduce voltage offsets and maintain gate driver performance.

The device thermal pad should be soldered to the PCB top-layer ground plane. Multiple vias should be used to connect to a large bottom-layer ground plane. The use of large metal planes and multiple vias helps dissipate the I2 × RDS(on) heat that is generated in the device.

To improve thermal performance, maximize the ground area that is connected to the thermal pad ground across all possible layers of the PCB. Using thick copper pours can lower the junction-to-air thermal resistance and improve thermal dissipation from the die surface.

Separate the SW_BK and FB_BK traces with ground separation to reduce buck switching from coupling as noise into the buck outer feedback loop. Widen the FB_BK trace as much as possible to allow for faster load switching.