JAJSST7A January   2024  – May 2024 MCF8315C-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings Auto
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Characteristics of the SDA and SCL bus for Standard and Fast mode
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Output Stage
      2. 6.3.2  Device Interface
        1. 6.3.2.1 Interface - Control and Monitoring
        2. 6.3.2.2 I2C Interface
      3. 6.3.3  Step-Down Mixed-Mode Buck Regulator
        1. 6.3.3.1 Buck in Inductor Mode
        2. 6.3.3.2 Buck in Resistor mode
        3. 6.3.3.3 Buck Regulator with External LDO
        4. 6.3.3.4 AVDD Power Sequencing from Buck Regulator
        5. 6.3.3.5 Mixed Mode Buck Operation and Control
        6. 6.3.3.6 Buck Under Voltage Protection
        7. 6.3.3.7 Buck Over Current Protection
      4. 6.3.4  AVDD Linear Voltage Regulator
      5. 6.3.5  Charge Pump
      6. 6.3.6  Slew Rate Control
      7. 6.3.7  Cross Conduction (Dead Time)
      8. 6.3.8  Motor Control Input Sources
        1. 6.3.8.1 Analog Mode Motor Control
        2. 6.3.8.2 PWM Mode Motor Control
        3. 6.3.8.3 I2C based Motor Control
        4. 6.3.8.4 Frequency Mode Motor Control
        5. 6.3.8.5 Speed Profiles
          1. 6.3.8.5.1 Linear Reference Profiles
          2. 6.3.8.5.2 Staircase Reference Profiles
          3. 6.3.8.5.3 Forward-Reverse Reference Profiles
      9. 6.3.9  Starting the Motor Under Different Initial Conditions
        1. 6.3.9.1 Case 1 – Motor is Stationary
        2. 6.3.9.2 Case 2 – Motor is Spinning in the Forward Direction
        3. 6.3.9.3 Case 3 – Motor is Spinning in the Reverse Direction
      10. 6.3.10 Motor Start Sequence (MSS)
        1. 6.3.10.1 Initial Speed Detect (ISD)
        2. 6.3.10.2 Motor Resynchronization
        3. 6.3.10.3 Reverse Drive
          1. 6.3.10.3.1 Reverse Drive Tuning
      11. 6.3.11 Motor Start-up
        1. 6.3.11.1 Align
        2. 6.3.11.2 Double Align
        3. 6.3.11.3 Initial Position Detection (IPD)
          1. 6.3.11.3.1 IPD Operation
          2. 6.3.11.3.2 IPD Release Mode
          3. 6.3.11.3.3 IPD Advance Angle
        4. 6.3.11.4 Slow First Cycle Start-up
        5. 6.3.11.5 Open loop
        6. 6.3.11.6 Transition from Open to Closed Loop
      12. 6.3.12 Closed Loop Operation
        1. 6.3.12.1 Closed Loop Acceleration/Deceleration Slew Rate
        2. 6.3.12.2 Speed PI Control
        3. 6.3.12.3 Current PI Control
        4. 6.3.12.4 Torque Mode
        5. 6.3.12.5 Overmodulation
      13. 6.3.13 Motor Parameters
        1. 6.3.13.1 Motor Resistance
        2. 6.3.13.2 Motor Inductance
        3. 6.3.13.3 Motor Back-EMF constant
      14. 6.3.14 Motor Parameter Extraction Tool (MPET)
      15. 6.3.15 Anti-Voltage Surge (AVS)
      16. 6.3.16 Active Braking
      17. 6.3.17 Output PWM Switching Frequency
      18. 6.3.18 PWM Modulation Schemes
      19. 6.3.19 Dead Time Compensation
      20. 6.3.20 Motor Stop Options
        1. 6.3.20.1 Coast (Hi-Z) Mode
        2. 6.3.20.2 Low-Side Braking
        3. 6.3.20.3 Active Spin-Down
      21. 6.3.21 FG Configuration
        1. 6.3.21.1 FG Output Frequency
        2. 6.3.21.2 FG during open loop
        3. 6.3.21.3 FG during idle and fault
      22. 6.3.22 DC Bus Current Limit
      23. 6.3.23 Protections
        1. 6.3.23.1  VM Supply Undervoltage Lockout
        2. 6.3.23.2  AVDD Undervoltage Lockout (AVDD_UV)
        3. 6.3.23.3  BUCK Under Voltage Lockout (BUCK_UV)
        4. 6.3.23.4  VCP Charge Pump Undervoltage Lockout (CPUV)
        5. 6.3.23.5  Overvoltage Protection (OVP)
        6. 6.3.23.6  Overcurrent Protection (OCP)
          1. 6.3.23.6.1 OCP Latched Shutdown (OCP_MODE = 00b)
          2. 6.3.23.6.2 OCP Automatic Retry (OCP_MODE = 01b)
        7. 6.3.23.7  Buck Overcurrent Protection
        8. 6.3.23.8  Hardware Lock Detection Current Limit (HW_LOCK_ILIMIT)
          1. 6.3.23.8.1 HW_LOCK_ILIMIT Latched Shutdown (HW_LOCK_ILIMIT_MODE = 00xxb)
          2. 6.3.23.8.2 HW_LOCK_ILIMIT Automatic recovery (HW_LOCK_ILIMIT_MODE = 01xxb)
          3. 6.3.23.8.3 HW_LOCK_ILIMIT Report Only (HW_LOCK_ILIMIT_MODE = 1000b)
          4. 6.3.23.8.4 HW_LOCK_ILIMIT Disabled (HW_LOCK_ILIMIT_MODE= 1xx1b)
        9. 6.3.23.9  Motor Lock (MTR_LCK)
          1. 6.3.23.9.1 MTR_LCK Latched Shutdown (MTR_LCK_MODE = 00xxb)
          2. 6.3.23.9.2 MTR_LCK Automatic Recovery (MTR_LCK_MODE= 01xxb)
          3. 6.3.23.9.3 MTR_LCK Report Only (MTR_LCK_MODE = 1000b)
          4. 6.3.23.9.4 MTR_LCK Disabled (MTR_LCK_MODE = 1xx1b)
        10. 6.3.23.10 Motor Lock Detection
          1. 6.3.23.10.1 Lock 1: Abnormal Speed (ABN_SPEED)
          2. 6.3.23.10.2 Lock 2: Abnormal BEMF (ABN_BEMF)
          3. 6.3.23.10.3 Lock3: No-Motor Fault (NO_MTR)
        11. 6.3.23.11 Minimum VM (undervoltage) Protection
        12. 6.3.23.12 Maximum VM (overvoltage) Protection
        13. 6.3.23.13 MPET Faults
        14. 6.3.23.14 IPD Faults
        15. 6.3.23.15 Thermal Warning (OTW)
        16. 6.3.23.16 Thermal Shutdown (TSD)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Functional Modes
        1. 6.4.1.1 Sleep Mode
        2. 6.4.1.2 Standby Mode
        3. 6.4.1.3 Fault Reset (CLR_FLT)
    5. 6.5 External Interface
      1. 6.5.1 DRVOFF Functionality
      2. 6.5.2 DAC output(s)
      3. 6.5.3 Current Sense Output
      4. 6.5.4 Oscillator Source
        1. 6.5.4.1 External Clock Source
      5. 6.5.5 External Watchdog
    6. 6.6 EEPROM access and I2C interface
      1. 6.6.1 EEPROM Access
        1. 6.6.1.1 EEPROM Write
        2. 6.6.1.2 EEPROM Read
      2. 6.6.2 I2C Serial Interface
        1. 6.6.2.1 I2C Data Word
        2. 6.6.2.2 I2C Write Transaction
        3. 6.6.2.3 I2C Read Transaction
        4. 6.6.2.4 I2C Communication Protocol Packet Examples
        5. 6.6.2.5 I2C Clock Stretching
        6. 6.6.2.6 CRC Byte Calculation
  8. 7 EEPROM (Non-Volatile) Register Map
    1. 7.1 Algorithm_Configuration Registers
    2. 7.2 Fault_Configuration Registers
    3. 7.3 Hardware_Configuration Registers
    4. 7.4 Internal_Algorithm_Configuration Registers
  9. 8 RAM (Volatile) Register Map
    1. 8.1 Fault_Status Registers
    2. 8.2 System_Status Registers
    3. 8.3 Device_Control Registers
    4. 8.4 Algorithm_Control Registers
    5. 8.5 Algorithm_Variables Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Application Curves
        1. 9.2.1.1 Motor startup
        2. 9.2.1.2 MPET
        3. 9.2.1.3 Dead time compensation
        4. 9.2.1.4 Auto handoff
        5. 9.2.1.5 Anti voltage surge (AVS)
        6. 9.2.1.6 Real time variable tracking using DACOUT
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Bulk Capacitance
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Thermal Considerations
        1. 9.4.2.1 Power Dissipation
  11. 10Device and Documentation Support
    1. 10.1 サポート・リソース
    2. 10.2 Trademarks
    3. 10.3 静電気放電に関する注意事項
    4. 10.4 用語集
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

4 Pin Configuration and Functions

MCF8315C-Q1 MCF8315C-Q1, 40-Pin VQFN With Exposed Thermal Pad, Top View Figure 4-1 MCF8315C-Q1, 40-Pin VQFN With Exposed Thermal Pad, Top View
MCF8315C-Q1 MCF8315C-Q1, 32-Pin WQFN With Exposed Thermal Pad, Top View Figure 4-2 MCF8315C-Q1, 32-Pin WQFN With Exposed Thermal Pad, Top View
MCF8315C-Q1 MCF8315C-Q1, 24-Pin HTSSOP With Exposed Thermal Pad, Top View Figure 4-3 MCF8315C-Q1, 24-Pin HTSSOP With Exposed Thermal Pad, Top View
Table 4-1 Pin Functions
PIN 40-pin package 32-pin package 24-pin package TYPE(1) DESCRIPTION
NAME MCF8315C-Q1 MCF8315C-Q1 MCF8315C-Q1
AGND 26 19 16 GND Device analog ground. Refer Layout Guidelines for connection recommendation.
ALARM 39 30 - O Alarm signal: push-pull output. Pulled logic high during fault condition, if enabled.

If ALARM pin is not used, leave it floating.
AVDD 27 20 17 PWR O 3.3-V internal regulator output. Connect a X5R or X7R, 1-µF, 6.3-V ceramic capacitor between the AVDD and AGND pins. This regulator can source up to 20 mA for external circuits.
BRAKE 35 28 24 I High → Brake the motor
Low → Normal motor operation

If BRAKE pin is not used, connect to AGND directly.

If BRAKE pin is used to brake the motor, use an (optional) external 10-kΩ pull-down resistor (to AGND) for better noise rejection.
CP 8 7 9 PWR Charge pump output. Connect a X5R or X7R, 1-µF, 16-V ceramic capacitor between the CP and VM pins.
CPH 7 6 8 PWR Charge pump switching node. Connect a X5R or X7R, 47-nF, ceramic capacitor between the CPH and CPL pins. TI recommends a capacitor voltage rating at least twice the normal operating voltage of the device.
CPL 6 5 7 PWR
DACOUT1 36 29 - O DAC output DACOUT1
DACOUT2 37 - - O DAC output DACOUT2
DACOUT2/SOX 38 - - O Multi-purpose pin:
DAC output when configured as DACOUT2
CSA output when configured as SOX
DGND 2 1 3 GND Device digital ground. Refer Layout Guidelines for connection recommendation.
DIR 34 27 - I Direction of motor spinning;
When low, phase driving sequence is OUT A → OUT C → OUT B
When high, phase driving sequence is OUT A → OUT B → OUT C

If DIR pin is not used, connect to AGND or AVDD directly (depending on phase driving sequence needed).

If DIR pin is used for changing motor spin direction, use an (optional) external 10-kΩ pulldown resistor (to AGND) for better noise rejection.
DRVOFF 21 18 15 I Coast (Hi-Z) all six MOSFETs as long as DRVOFF is high.

If DRVOFF pin is not used, connect to AGND directly.

If DRVOFF pin is to be used for instantly coasting (Hi-Z) the MOSFETs, use an external 10-kΩ pull-down resistor (to AGND) for better noise rejection.
DVDD 1 32 2 PWR 1.5-V internal regulator output. Connect a X5R or X7R, 2.2-µF, 6.3-V ceramic capacitor between the DVDD and DGND pins.
EXT_CLK 33 26 23 I External clock reference input in external clock reference mode.
EXT_WD 32 25 22 I External watchdog input.
FB_BK 3 2 4 PWR I/O Feedback for buck regulator output control. Connect to buck regulator output after the inductor/resistor.
FG 29 22 19 O Motor speed indicator : open-drain output that requires an external pull-up resistor to 1.8-V to 5.0-V. An optional internal pull-up resistor to AVDD is enabled by setting PULLUP_ENABLE to 1b; no external pull-up resistor should be used when internal pull-up resistor is enabled.
GND_BK 4 3 5 GND Buck regulator ground. Refer Layout Guidelines for connection recommendation.
NC 22, 23, 24, 25 - - - No connection. Leave these pins floating or connect to Thermal pad for better heat dissipation.
nFAULT 40 31 1 O Fault indicator. Pulled logic-low during fault condition; open-drain output that requires an external pull-up resistor to 1.8-V to 5.0-V. An optional internal pull-up resistor to AVDD is enabled by setting PULLUP_ENABLE to 1b; no external pull-up resistor should be used when internal pull-up resistor is enabled.
OUTA 13, 14 11, 12 12 PWR O Half-bridge output A
OUTB 16, 17 13, 14 13 PWR O Half-bridge output B
OUTC 19, 20 15, 16 14 PWR O Half-bridge output C
PGND 12, 15, 18 10, 17 11 GND Device power ground. Refer Layout Guidelines for connection recommendation.
SCL 31 24 21 I I2C clock input
SDA 30 23 20 I/O I2C data line
SPEED/WAKE 28 21 18 I Device speed input; supports analog, PWM or frequency based speed input. The speed pin input can be configured through SPEED_MODE.
SW_BK 5 4 6 PWR Buck switch node. Connect this pin to an inductor or resistor.
VM 9, 10, 11 8, 9 10 PWR I Device and motor power supply. Connect to motor supply voltage; bypass to PGND with one 0.1-µF capacitor plus one bulk capacitor. TI recommends a capacitor voltage rating at least twice the normal operating voltage of the device.
Thermal pad GND Must be connected to AGND.
(1) I = input, O = output, GND = ground, PWR = power, NC = no connect