JAJSEA9A December 2017 – March 2018 MSP430FR5969-SP
PRODUCTION DATA.
THERMAL METRIC | PACKAGE | VALUE | UNIT | |
---|---|---|---|---|
θJA | Junction-to-ambient thermal resistance(1) | QFN-48 (RGZ) | 30.6 | °C/W |
θJC(TOP) | Junction-to-case (top) thermal resistance(2) | 17.2 | °C/W | |
θJB | Junction-to-board thermal resistance(4) | 7.2 | °C/W | |
ΨJB | Junction-to-board thermal characterization parameter | 7.2 | °C/W | |
ΨJT | Junction-to-top thermal characterization parameter | 0.2 | °C/W | |
θJC(BOTTOM) | Junction-to-case (bottom) thermal resistance(3) | 1.2 | °C/W | |
θJA | Junction-to-ambient thermal resistance, still air(1) | QFP-48 (PHP) | 26.9 | °C/W |
θJC(TOP)\ | Junction-to-case (top) thermal resistance(2) | 16.4 | °C/W | |
θJB | Junction-to-board thermal resistance(4) | 7.6 | °C/W | |
ΨJB | Junction-to-board thermal characterization parameter | 7.6 | °C/W | |
ΨJT | Junction-to-top thermal characterization parameter | 0.2 | °C/W | |
θJC(BOTTOM) | Junction-to-case (bottom) thermal resistance(3) | 1.5 | °C/W |