JAJSUK2A September 2000 – June 2024 OPA2241 , OPA2251 , OPA241 , OPA251 , OPA4241 , OPA4251
PRODUCTION DATA
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THERMAL METRIC(1) | OPA2241 AND OPA2251 | UNIT | ||
---|---|---|---|---|
D (SOIC) | P (PDIP) | |||
8 PINS | 8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 150 | 100 | ℃/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 61.0 | N/A | ℃/W |
RθJB | Junction-to-board thermal resistance | 68.3 | N/A | ℃/W |
ψJT | Junction-to-top characterization parameter | 10.8 | N/A | ℃/W |
ψJB | Junction-to-board characterization parameter | 67.4 | N/A | ℃/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | ℃/W |