10.1.1 MIX Supply Decapacitors

The VMIXH supply has a peak load current requirement of approximately 600 mA during the integration phase. Moreover, a break-before-make circuit is used during the reversal of the demodulation polarity to avoid high through currents. The break-before-make strategy results in a pulse with a drop and a subsequent rise of demodulation current. The pulse duration is typically approximately 1 ns. In order to effectively support the rise in currents, VMIXH decoupling capacitors must be placed very close to the package. Furthermore, use multiple capacitors to reduce the effect of equivalent series inductance and resistance of the decoupling capacitors. Use a combination of 10-nF and 1-nF capacitors per VMIXH pin. Using vias for routing the trace from decoupling capacitors to the package pins must be avoided.

10.1.2 LVDS Transmitters

Each LVDS data output pair must be routed as a 100-Ω differential pair. When used with the OPT9221, 100-Ω termination resistors must be placed close to the OPT9221.

10.1.3 Optical Centering

The lens mount placement on the printed circuit board (PCB) must be such that the lens optical center aligns with the pixel array optical center. Note that the pixel array center is different from the package center.

10.1.4 Image Orientation

The sensor orientation for obtaining an upright image is shown in Figure 18.

Figure 18. Sensor Orientation for Obtaining an Upright Image

10.1.5 Thermal Considerations

In some applications, special care must be taken to avoid high sensor temperatures because demodulation power is considerably high for the size of the package. Lower sensor temperatures help lower the thermal noise floor as well as reduce the leakage currents. Two recommended methods for achieving better package to PCB thermal coupling are listed below:

• Use a thermal pad below the sensor on both sides of the PCB with stitched vias.
• Use a compatible underfill.

10.3.1 Board-Level Reliability

TI chip-on-glass products are designed and tested with underfill to ensure excellent board-level reliability in intended applications. If a customer chooses to underfill a chip-on-glass product, following the guidelines below is recommended to maximize the board level reliability:

• The underfill material must extend partially up the package edges. Underfill that ends at the bottom (ball side) of the die degrades reliability.
• The underfill material must have a coefficient of thermal expansion (CTE) closely matched to the CTE of the solder interconnect.
• The underfill material must have a glass transition temperature (Tg) above the expected maximum exposure temperature.

10.3.2 Handling

To avoid dust particles on the sensor, the sensor tray must only be opened in a cleanroom facility. In case of accidental exposure to dust, the recommended method to clean the sensors is to use an IPA solution with a micro-fiber cloth swab with no lint. Do not handle the sensor edges with hard or abrasive materials (such as metal tweezers) because the sensor package has a glass outline. Such handling may lead to cracks that can negatively affect package reliability and image quality.