JAJSUY5 May   2024 PCM1809

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements: TDM, I2S or LJ Interface
    7. 5.7 Switching Characteristics: TDM, I2S or LJ Interface
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Hardware Control
      2. 6.3.2 Audio Serial Interfaces
        1. 6.3.2.1 Time Division Multiplexed Audio (TDM) Interface
        2. 6.3.2.2 Inter IC Sound (I2S) Interface
      3. 6.3.3 Phase-Locked Loop (PLL) and Clock Generation
      4. 6.3.4 Input Channel Configurations
      5. 6.3.5 Reference Voltage
      6. 6.3.6 Signal-Chain Processing
        1. 6.3.6.1 Digital High-Pass Filter
        2. 6.3.6.2 Configurable Digital Decimation Filters
          1. 6.3.6.2.1 Linear Phase Filters
            1. 6.3.6.2.1.1 Sampling Rate: 8 kHz or 7.35 kHz
            2. 6.3.6.2.1.2 Sampling Rate: 16 kHz or 14.7 kHz
            3. 6.3.6.2.1.3 Sampling Rate: 24 kHz or 22.05 kHz
            4. 6.3.6.2.1.4 Sampling Rate: 32 kHz or 29.4 kHz
            5. 6.3.6.2.1.5 Sampling Rate: 48 kHz or 44.1 kHz
            6. 6.3.6.2.1.6 Sampling Rate: 96 kHz or 88.2 kHz
            7. 6.3.6.2.1.7 Sampling Rate: 192 kHz or 176.4 kHz
          2. 6.3.6.2.2 Low-Latency Filters
            1. 6.3.6.2.2.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 6.3.6.2.2.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 6.3.6.2.2.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 6.3.6.2.2.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 6.3.6.2.2.5 Sampling Rate: 96 kHz or 88.2 kHz
    4. 6.4 Device Functional Modes
      1. 6.4.1 Active Mode
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
  9. Power Supply Recommendations
  10. Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 ドキュメントの更新通知を受け取る方法
    2. 10.2 サポート・リソース
    3. 10.3 Trademarks
    4. 10.4 静電気放電に関する注意事項
    5. 10.5 用語集
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Layout Guidelines

Each system design and printed circuit board (PCB) layout is unique. The layout must be carefully reviewed in the context of a specific PCB design. However, the following guidelines can optimize the device performance:

  • Connect the thermal pad to ground. Use a via pattern to connect the device thermal pad, which is the area directly under the device, to the ground planes. This connection helps dissipate heat from the device.
  • The decoupling capacitors for the power supplies must be placed close to the device pins.
  • Route the analog differential audio signals differentially on the PCB for better noise immunity. Avoid crossing digital and analog signals to prevent undesirable crosstalk.
  • The device internal voltage references must be filtered using external capacitors. Place the filter capacitors near the VREF pin for optimal performance.
  • Directly short the VREF external capacitor ground terminal to the AVSS pin without using any vias for this connection trace.
  • Use ground planes to provide the lowest impedance for power and signal current between the device and the decoupling capacitors. Treat the area directly under the device as a central ground area for the device, and all device grounds must be connected directly to that area.