JAJSUY5 May   2024 PCM1809

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements: TDM, I2S or LJ Interface
    7. 5.7 Switching Characteristics: TDM, I2S or LJ Interface
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Hardware Control
      2. 6.3.2 Audio Serial Interfaces
        1. 6.3.2.1 Time Division Multiplexed Audio (TDM) Interface
        2. 6.3.2.2 Inter IC Sound (I2S) Interface
      3. 6.3.3 Phase-Locked Loop (PLL) and Clock Generation
      4. 6.3.4 Input Channel Configurations
      5. 6.3.5 Reference Voltage
      6. 6.3.6 Signal-Chain Processing
        1. 6.3.6.1 Digital High-Pass Filter
        2. 6.3.6.2 Configurable Digital Decimation Filters
          1. 6.3.6.2.1 Linear Phase Filters
            1. 6.3.6.2.1.1 Sampling Rate: 8 kHz or 7.35 kHz
            2. 6.3.6.2.1.2 Sampling Rate: 16 kHz or 14.7 kHz
            3. 6.3.6.2.1.3 Sampling Rate: 24 kHz or 22.05 kHz
            4. 6.3.6.2.1.4 Sampling Rate: 32 kHz or 29.4 kHz
            5. 6.3.6.2.1.5 Sampling Rate: 48 kHz or 44.1 kHz
            6. 6.3.6.2.1.6 Sampling Rate: 96 kHz or 88.2 kHz
            7. 6.3.6.2.1.7 Sampling Rate: 192 kHz or 176.4 kHz
          2. 6.3.6.2.2 Low-Latency Filters
            1. 6.3.6.2.2.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 6.3.6.2.2.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 6.3.6.2.2.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 6.3.6.2.2.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 6.3.6.2.2.5 Sampling Rate: 96 kHz or 88.2 kHz
    4. 6.4 Device Functional Modes
      1. 6.4.1 Active Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 ドキュメントの更新通知を受け取る方法
    2. 10.2 サポート・リソース
    3. 10.3 Trademarks
    4. 10.4 静電気放電に関する注意事項
    5. 10.5 用語集
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.5 用語集