5 Revision History
Changes from G Revision (October 2013) to H Revision
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Added the Pin Configuration and Functions section, Recommended Operating Conditions table, Thermal Information table, Feature Description section, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
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Added A-Q1 to the end of the device numbers Go
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Changed the MIN and MAX values for the REF5040 initial accuracy parameter in the Electrical Characteristics table Go
Changes from F Revision (September 2011) to G Revision
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Deleted reference to high grade throughout the documentGo
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Deleted Package/Ordering Information table from datasheetGo
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Deleted references to the MSOP-8 package and High-Grade from the THERMAL HYSTERESIS section of the ELECTRICAL CHARACTERISTICS: ALL DEVICES tableGo
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Deleted references to the MSOP-8 package from the LONG-TERM STABILITY section of the ELECTRICAL CHARACTERISTICS: ALL DEVICES tableGo
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Deleted graphs for MSOP-8 package from TYPICAL CHARACTERISTICS sectionGo
Changes from E Revision (August 2011) to F Revision
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Added REF5045AQDRQ1 HBM ESD rating of 1000 VGo
Changes from D Revision (October, 2010) to E Revision
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Added Thermal Hysteresis parameters and specificationsGo
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Added Long-Term Stability parameters and specificationsGo
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Added Figure 22 through Figure 24Go
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Added Thermal Hysteresis sectionGo
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Revised Noise Performance section; added paragraph with links to applications articlesGo