JAJSL60F April   1977  – January 2021 SG2524 , SG3524

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configurations and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
  7. 7 12
    1. 7.1 Electrical Characteristics
    2. 7.2 Electrical Characteristics — Continued, Both Parts
    3. 7.3 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 17
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Blanking
      2. 9.3.2 Error Amplifier
      3. 9.3.3 Compensation
      4. 9.3.4 Output Circuitry
      5. 9.3.5 Current Limiting
    4. 9.4 Device Functional Modes
      1. 9.4.1 Synchronous Operation
      2. 9.4.2 Shutdown Circuitry
        1.       Application and Implementation
          1. 10.1 Application Information
          2. 10.2 Typical Application
            1. 10.2.1 Capacitor-Diode Output
              1. 10.2.1.1 Design Requirements
              2. 10.2.1.2 Detailed Design Procedure
                1. 10.2.1.2.1 Oscillator
                2. 10.2.1.2.2 Voltage Reference
              3. 10.2.1.3 Application Curves
          3. 10.3 Examples of Other Output Stages
            1. 10.3.1 Flyback Converter
            2. 10.3.2 Single-Ended LC
            3. 10.3.3 Push-Pull Transformer-Coupled
              1.          Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Feedback Traces
      2. 10.1.2 Input/Output Capacitors
      3. 10.1.3 Compensation Components
      4. 10.1.4 Traces and Ground Planes
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Trademarks
      1.      Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • NS|16
  • N|16
  • D|16
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1)SGx524UNIT
DNNS
16 PINS
RθJAJunction-to-ambient thermal resistance(2)(3)736764°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operation at the absolute maximum TJ of 150°C can impact reliability.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.