JAJSPG7 データシート

JAJSPG7B April 1998 – January 2023 SN65ALS1176

PRODUCTION DATA

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

6.3 Thermal Information

THERMAL METRIC⁽¹⁾		D (SOIC)	UNIT
THERMAL METRIC⁽¹⁾		8-Pins	UNIT
R _θJA	Junction-to-ambient thermal resistance	116.7	°C/W
R _θJC(top)	Junction-to-case thermal resistance	56.3	°C/W
R _θJB	Junction-to-board thermal resistance	63.4	°C/W
ψ _JT	Junction-to-top characterization parameter	8.8	°C/W
ψ _JB	Junction-to-board characterization parameter	62.6	°C/W
R _θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.