JAJSO47C July   2009  – June 2022 SN65HVDA195-Q1

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 概要 (続き)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Local Interconnect Network (LIN) Bus
        1. 9.3.1.1 Transmitter Characteristics
        2. 9.3.1.2 Receiver Characteristics
      2. 9.3.2 Transmit Input (TXD)
      3. 9.3.3 Receive Output (RXD)
        1. 9.3.3.1 RXD Wake-Up Request
      4. 9.3.4 Supply Voltage (VSUP)
      5. 9.3.5 Ground (GND)
      6. 9.3.6 Enable Input (EN)
      7. 9.3.7 NWake Input (NWake)
      8. 9.3.8 Inhibit Output (INH)
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operating Modes
      2. 9.4.2 Normal Mode
      3. 9.4.3 Sleep Mode
      4. 9.4.4 Wake-Up Events
      5. 9.4.5 Standby Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Typical Application
        1. 10.1.1.1 Design Requirements
        2. 10.1.1.2 Detailed Design Procedure
        3. 10.1.1.3 Application Curves
      2.      Power Supply Recommendations
      3. 10.1.2 Layout
        1. 10.1.2.1 Layout Guidelines
        2. 10.1.2.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 サポート・リソース
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4 Thermal Information

THERMAL METRIC(1) D (SOIC) UNIT
8 PINS
RθJA Junction-to-ambient thermal resistance 112.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 66.3 °C/W
RθJB Junction-to-board thermal resistance 52.9 °C/W
ψJT Junction-to-top characterization parameter 19.3 °C/W
ψJB Junction-to-board characterization parameter 52.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.