JAJSP94G January   1994  – October 2022 SN65LBC179 , SN75LBC179

PRODUCTION DATA  

  1. 1特長
  2. 2概要
  3. 3Revision History
  4. 4Pin Configuration and Functions
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Dissipation Rating Table
    5. 5.5 Electrical Characteristics - Driver
    6. 5.6 Switching Characteristics - Driver
    7. 5.7 Electrical Characteristics - Receiver
    8. 5.8 Switching Characteristics - Receiver
    9. 5.9 Typical Characteristics
  6. 6Parameter Measurement Information
  7. 7Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Device Functional Modes
    3. 7.3 Thermal Characteristics of IC Packages
  8. 8Device and Documentation Support
    1. 8.1 Device Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 サポート・リソース
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.3 Thermal Information

THERMAL METRIC(1) D (SOIC) P (PDIP) UNIT
8 Pins 8 Pins
R θJA Junction-to-ambient thermal resistance 116.7 65.6.4 °C/W
R θJC(top) Junction-to-case (top) thermal resistance 63.4 54.6 °C/W
R θJB Junction-to-board thermal resistance 56.3 42.1 °C/W
ψ JT Junction-to-top characterization parameter 8.8 22.9 °C/W
ψ JB Junction-to-board characterization parameter 62.6 41.6 °C/W
R θJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a °C/W
(1) See TI application note literature number https://www.ti.com/lit/pdf/SZZA003, Package Thermal Characterization Methodologies, for an explanation of this parameter.