JAJSV24J October 1996 – July 2024 SN65LBC184 , SN75LBC184
PRODUCTION DATA
THERMAL METRIC(1) | P (PDIP) | D (SOIC) | UNIT | |
---|---|---|---|---|
8 PINS | ||||
RθJA | Junction-to-ambient thermal resistance | 108.7 | 116.3 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 34.8 | 41.3 | °C/W |
RθJB | Junction-to-board thermal resistance | 23.6 | 61.4 | °C/W |
ψJT | Junction-to-top characterization parameter | 12 | 4.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 23.5 | 60.3 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |