JAJSL15N July   1997  – April 2021 SN55LVDS31 , SN65LVDS31 , SN65LVDS3487 , SN65LVDS9638

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 概要 (続き)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings #GUID-35E89C88-1E48-404C-8AB6-22CCA817C2ED/SLLS2613609
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: SN55LVDS31
    6. 7.6 Electrical Characteristics: SN65LVDSxxxx
    7. 7.7 Switching Characteristics: SN55LVDS31
    8. 7.8 Switching Characteristics: SN65LVDSxxxx
    9. 7.9 Typical Characteristics
      1. 7.9.1 17
  8. 8 Parameter Measurement Information
    1. 8.1 19
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Driver Disabled Output
      2. 9.3.2 NC Pins
      3. 9.3.3 Unused Enable Pins
      4. 9.3.4 Driver Equivalent Schematics
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Point-to-Point Communications
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Driver Supply Voltage
          2. 10.2.1.2.2 Driver Bypass Capacitance
          3. 10.2.1.2.3 Driver Output Voltage
          4. 10.2.1.2.4 Interconnecting Media
          5. 10.2.1.2.5 PCB Transmission Lines
          6. 10.2.1.2.6 Termination Resistor
          7. 10.2.1.2.7 Driver NC Pins
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Multidrop Communications
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 Interconnecting Media
        3. 10.2.2.3 Application Curve
  11. 11Power Supply Recommendations
    1. 11.1 49
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Microstrip vs. Stripline Topologies
      2. 12.1.2 Dielectric Type and Board Construction
      3. 12.1.3 Recommended Stack Layout
      4. 12.1.4 Separation Between Traces
      5. 12.1.5 Crosstalk and Ground Bounce Minimization
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Other LVDS Products
    2. 13.2 Documentation Support
      1. 13.2.1 Related Information
      2. 13.2.2 ドキュメントの更新通知を受け取る方法
      3. 13.2.3 Related Links
    3. 13.3 サポート・リソース
    4. 13.4 Trademarks
    5. 13.5 静電気放電に関する注意事項
    6. 13.6 用語集
  14. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • PW|16
  • NS|16
  • D|16
サーマルパッド・メカニカル・データ
発注情報

7.2 ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)±8000V
Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds260°C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.