JAJSJQ8J October   2004  – September 2020 SN74AUP1T97

PRODUCTION DATA  

  1. 1特長
  2. 2概要
  3. 3Revision History
  4. 4Pin Configuration and Functions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Switching Characteristics
    8. 5.8  Switching Characteristics
    9. 5.9  Switching Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Switching Characteristics
    12. 5.12 Switching Characteristics
    13. 5.13 Operating Characteristics
    14. 5.14 Typical Characteristics
  6. 6Parameter Measurement Information
  7. 7Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Feature Description
    3. 7.3 Device Functional Modes
      1. 7.3.1 Logic Configurations
  8. 8Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.5 Thermal Information

THERMAL METRIC(1)SN74AUP1T97UNIT
YFP (DSBGA)YZP (DSBGA)
6 PINS6 PINS
RθJAJunction-to-ambient thermal resistance123123°C/W
RθJC(top)Junction-to-case (top) thermal resistance°C/W
RθJBJunction-to-board thermal resistance°C/W
ψJTJunction-to-top characterization parameter°C/W
ψJBJunction-to-board characterization parameter°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.