JAJSGK7C December   2018  – September 2020 SN74AXCH1T45

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Operating Characteristics: TA = 25°C
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Load Circuit and Voltage Waveforms
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Standard CMOS Inputs
      2. 8.3.2 Balanced High-Drive CMOS Push-Pull Outputs
      3. 8.3.3 Partial Power Down (Ioff)
      4. 8.3.4 VCC Isolation
      5. 8.3.5 Over-voltage Tolerant Inputs
      6. 8.3.6 Negative Clamping Diodes
      7. 8.3.7 Fully Configurable Dual-Rail Design
      8. 8.3.8 Supports High-Speed Translation
      9. 8.3.9 Bus-Hold Data Inputs
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Enable Times
    2. 9.2 Typical Applications
      1. 9.2.1 Interrupt Request Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Universal Asynchronous Receiver-Transmitter (UART) Interface Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

4 Revision History

Changes from Revision B (June 2020) to Revision C (September 2020)

  • Updated ICCA, ICCB, and ICCA + ICCB to reflect updated performance of device.Go

Changes from Revision A (January 2019) to Revision B (June 2020)

  • 「製品情報」表に DRY パッケージ・オプションを追加Go
  • Added pinout drawing for DRY packageGo

Changes from Revision * (December 2018) to Revision A (January 2019)

  • 「製品情報」表に DBV および DTQ パッケージ・オプションを追加Go
  • 「改訂履歴」セクションを更新Go
  • Added pinout drawings for DBV and DTQ packages Go
  • Added DRY package to Pin ConfigurationsGo