SCLS746A February   2014  – October 2014 SN74GTL2014

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dynamic Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 5 V tolerance on LVTTL input
      2. 8.3.2 3.6 V tolerance on GTL Input/Output
      3. 8.3.3 Ultra-Low VREF and High Bandwidth
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 GTL-/GTL/GTL+ to LVTTL
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 LVTTL/TTL to GTL-/GTL/GTL+
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6 Specifications

6.1 Absolute Maximum Ratings

Specified at TA = –40°C to 85°C unless otherwise noted(1)
MIN MAX UNIT
VCC Supply voltage –0.5 4.6 V
IIK Input clamping current, VI < 0 V –50 mA
VSEL Input control voltages SEL(2)(3) –0.5 6 V
VI Input voltage A port –0.5 7 V
B port –0.5 4.6
IOK Control input clamp current, VO < 0 V –50 mA
VO Output voltage A port –0.5 7 V
B port –0.5 4.6
IOL Current into any output in the low state A port 40 mA
B port 80
IOH Current into any output in the high state –40 mA
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified
(3) VI and VO are used to denote specific conditions for VI/O

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –55 150 °C
VESD(1) Human Body Model (HBM), JEDEC: JESD22-A114(2) All pins 0 2 kV
IEC61000-4-2 contact discharge(3) All pins 0 1
(1) Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by assembly line electrostatic discharges into the device.
(2) Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as 250 V may actually have higher performance.
(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as 250 V may actually have higher performance.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN NOM MAX UNIT
VCC Supply voltage 3 3.3 3.6 V
VTT Termination voltage GTL– 0.85 0.9 0.95 V
GTL 1.14 1.2 1.26
GTL+ 1.35 1.5 1.65
VREF Reference voltage Overall 0.5 2 / 3 VTT VCC / 2 V
GTL– 0.5 0.6 0.63
GTL 0.76 0.8 0.84
GTL+ 0.87 1 1.1
VI Input voltage A port 0 3.3 5.5(2) V
B port 0 VTT 3.6
VIH High-level input voltage A port and DIR 2 V
B port VREF + 50 mV
VIL Low-level input voltage A port and DIR 0.8 V
B port VREF – 50 mV
IOH High-level input current A port –20 mA
IOL Low-level output current A port 20 mA
B port 50
(1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
(2) The VI(max) of LVTTL port is 3.6 V if configured as output (DIR=L)

6.4 Thermal Information

THERMAL METRIC(1) SN74GTL2014 UNIT
PW
14 PINS
RθJA Junction-to-ambient thermal resistance 136.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 63.0
RθJB Junction-to-board thermal resistance 78.6
ψJT Junction-to-top characterization parameter 11.9
ψJB Junction-to-board characterization parameter 77.9
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Specified at TA = –40°C to 85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS –40°C TO 85°C UNIT
MIN TYP MAX
VOH A port VCC = 3 to 3.6 V, IOH = –100 µA VCC – 0.2 V
VCC = 3 V, IOH = –16 mA 2
VOL A port VCC = 3 V, IOL = 8 mA 0.28 0.4 V
A port VCC = 3 V, IOL = 16 mA 0.55 0.8
B port VCC = 3 V, IOL = 40 mA 0.23 0.4
II A port VCC = 3.6 V, VI = VCC ±1 µA
VCC = 3.6, VI = 0 V ±1
VCC = 3.6, VI = 5.5 V 5
B port VCC = 3.6 V, VI = VTT or GND ±1 µA
Control pin VCC = 3.6 V, VI = VCC or 0 V ±1 µA
Ioff OFF-state output current on A port VCC = 0 V, VIO = 0 to 3.6 V ±10 µA
OFF-state output current on A port VCC = 0 V, VIO 3.6 to 5.5V ±100
OFF-state output current on B port VCC = 0 V, VIO = 0 to 3.6 V ±10
ICC A port VCC = 3.6 V, VI = VCC or GND, IO = 0 3 10 mA
B port VCC = 3.6 V, VI = VTT or GND, IO = 0 3 10 mA
∆ICC A port or control input VCC = 3.6 V, VI = VCC – 0.6 V 500 µA
CI Input capacitance of control pin VI = 3.0 V or 0 V 2 2.5 pF
CIO A port VO = 3 V or 0 4 6 pF
B port VO = VTT or 0 5.46 5.55

6.6 Dynamic Electrical Characteristics

over operating range, TA = –40°C to 85°C, VCC = 1.65 to 4.6 V, GND = 0 V for GTL (see Functional Block Diagram)
PARAMETER GTL− GTL GTL+ UNIT
VCC = 3.3 V ± 0.3 V
VREF = 0.6 V
VTT = 0.9 V		 VCC = 3.3 V ± 0.3 V
VREF = 0.8 V
VTT = 1.2 V		 VCC = 3.3 V ± 0.3 V
VREF = 1 V
VTT = 1.5 V
MIN TYP MAX MIN TYP MAX MIN TYP MAX
tPLH (low to high propagation delay) An to Bn 2.8 5 2.8 5 2.8 5 ns
tPHL(high to low propagation delay) 3.3 7 3.4 7 3.4 7
tPLH (low to high propagation delay) Bn to An 5.3 8 5.2 8 5.1 8 ns
tPHL (high to low propagation delay) 5.2 8 4.9 7.16 4.7 7.16

6.7 Typical Characteristics

C001_SCLS746.pngFigure 1. GTL Vth+ and Vth– vs VREF (25°C)
C003_SCLS746.pngFigure 3. GTL Vth+ and Vth– vs VREF (125°C)
C002_SCLS746.pngFigure 2. GTL Vth+ and Vth– vs VREF (–40°C)