JAJSMM5B June   2006  – August 2021 SN65C3222E , SN75C3222E

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings - IEC Specifications
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information: SN65C3222E
    6. 6.6  Thermal Information: SN75C3222E
    7. 6.7  Electrical Characteristics
    8. 6.8  Electrical Characteristics: Driver
    9. 6.9  Switching Characteristics: Driver
    10. 6.10 Electrical Characteristics: Receiver
    11. 6.11 Switching Characteristics: Receiver
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 サポート・リソース
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.5 Thermal Information: SN65C3222E

THERMAL METRIC(1)SN65C3222EUNIT
DB (SSOP)DW (SOIC)PW (TSSOP)
20 Pins20 Pins20 Pins
R θJAJunction-to-ambient thermal resistance7058

94.1

°C/W
R θJC(top)Junction-to-case (bottom) thermal resistance

33.6

30.0

35.2

°C/W
R θJBJunction-to-board thermal resistance

36.4

29.6

45.5

°C/W
ψ JTJunction-to-top characterization parameter

4.8

7.7

3.1

°C/W
ψ JBJunction-to-board characterization parameter

35.9

29.3

45.1

°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.