JAJSMM5B June   2006  – August 2021 SN65C3222E , SN75C3222E

PRODUCTION DATA  

  1. 特長
  2. アプリケーション
  3. 概要
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings - IEC Specifications
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information: SN65C3222E
    6. 6.6  Thermal Information: SN75C3222E
    7. 6.7  Electrical Characteristics
    8. 6.8  Electrical Characteristics: Driver
    9. 6.9  Switching Characteristics: Driver
    10. 6.10 Electrical Characteristics: Receiver
    11. 6.11 Switching Characteristics: Receiver
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 サポート・リソース
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

ESD Ratings

VALUEUNIT
V (ESD)Electrostatic dischargeHuman-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

All pins except RIN1, RIN2, DOUT1 and DOUT2 pins

±3,000V

RIN1, RIN2, DOUT1 and DOUT2 pins to GND

±15,000
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

All pins

±1,500
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.