SLLSE12A November   2009  – July 2014 SN75DP119

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Pre-Emphasis and VOD Output Swing Setings
    4. 9.4 Device Functional Modes
      1. 9.4.1 Status Detect and Operating Modes Flow Diagram
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Trademarks
    2. 13.2 Electrostatic Discharge Caution
    3. 13.3 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply Voltage Range(2) VCC –0.3 4 V
Voltage Range Main Link I/O (OUTx, INx) Differential Voltage –0.3 VCC + 0.3 V
Control Inputs –0.3 5.5 V
Continuous power dissipation See the Thermal Information Table
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to network ground terminal.

7.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) –12 12 kV
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) –1000 1000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Supply Voltage 3 3.3 3.6 V
TA Operating free-air temperature -40 85 °C
3-LEVEL CONTROL PINS (EN, VOD_CTL, PRE_CTL, EQ_CTL)
VIH High-level input voltage VCC–0.5 V
VIM Mid-level input voltage VCC/2–0.3 VCC/2+0.3 V
VIL Low-level input voltage 0.5 V
MAIN LINK DIFFERENTIAL INPUT AND OUTPUT PINS IN[4:1] AND OUT[4:1]
VID Peak-to-peak input differential voltage – HBR (high bit rate) 0.15 1.4 VPP
VID Peak-to-peak input differential voltage – LBR (low bit rate) 0.15 1.4 VPP
dR Data rate 2.7 Gbps
CAC AC coupling capacitance (each input and each output line) 1×75 2×200 nF
Rtdiff Differential output termination resistance 80 100 120 Ω
VOterm Output termination voltage (AC coupled) 0 2 V
tSK(in HBR) Intra-pair skew at the input package pins using 2.7 Gbps input data rate 100 ps
tSK(in LBR) Intra-pair skew at the input package pins using 1.62 Gbps input data rate 300 ps
tR/F Input rise and fall time 160 ps

7.4 Thermal Information

THERMAL METRIC(1) RGY RHH UNIT
14 PINS 36 PINS
RθJA Junction-to-ambient thermal resistance 45 34 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 20 20
RθJB Junction-to-board thermal resistance 16 17
ψJT Junction-to-top characterization parameter n/a n/a
ψJB Junction-to-board characterization parameter n/a n/a
RθJC(bot) Junction-to-case (bottom) thermal resistance 12 12
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ICCDP1max Supply current 1 DP lane selected WorstCase:
EN = VCC/2 (1-lane) or VCC (2-lane selected);
2.7Gbps PRBS; VID = 400 mVPP; VOD = 300 mVpp,
8.5 dB pre-emp (PRE_CTL=VCC; VOD_CTL=GND);
EQ_CTL = VCC (6 dB); VCC = 3.3 V (for typ) and
VCC = 3.6 V (for max), (1)		 16.2 21.3 mA
ICCDP2max Supply current 2 DP lanes selected 31.7 41.4 mA
ICCDP3max Supply current 1 DP lane selected EN = VCC/2 (1-lane) or VCC (2-lane selected);
2.7Gbps PRBS; VID = 400 mVPP; VOD = 300 mVPP,
0 dB pre-emp (PRE_CTL = GND); VOD_CTL = VCC/2);
EQ_CTL=GND (0 dB); VCC = 3.3 V (for typ) and
VCC = 3.6 V (for max), 		12.9 17.6 mA
ICCDP4max Supply current 2 DP lanes selected 24.9 34.1 mA
ICCDP1typ Supply current 1 DP lane selected EN = VCC/2 (1-lane) or VCC (2-lane selected);
2.7Gbps PRBS; IN/OUT; VID = 600 mVPP; (PRE_CTL=GND); VOD_CTL = VCC); VCC = 3.3 V, EQ_CTL = GND (no EQ) (2)		 14.5 mA
ICCDP2typ Supply current 2 DP lanes selected 28.2 mA
ICCDP3typ Supply current 1 DP lane selected EN = VCC/2 (1-lane) or VCC (2-lane selected);
2.7Gbps PRBS; no pre-emp; IN/OUT; VID = 800 mVPP; (PRE_CTL= VOD_CTL = VCC); VCC = 3.3 V, EQ_CT L = GND (no EQ) (3)		 14.5 mA
ICCDP4typ Supply current 2 DP lanes selected 28.2 mA
IPWRDN Shutdown current (PWRDN mode) EN = GND; 25 100 µA
3-LEVEL CONTROL PINS (EN, VOD_CTL, PRE_CTL, EQ_CTL)
IL Low-level input current VI = 0.5 V; VCC = 3.6 V –30 30 µA
IH High-level input current VI = VCC – 0.5 V; Vcc = 3.6V –30 30 µA
IM Mid-level input current VI = VCC /2 – 0.3V and VI = VCC /2 + 0.3 V; VCC = 3.6 V –30 30 µA
Rbias Input bias resistance See Figure 6 105 125 145 kΩ
RESD input series resistance to biasing network See Figure 6 2 2.4 kΩ
IN[1:0], OUT[1:0] (4)
[VOD(0.3)] Output differential voltage swing VPRE = VPRE(0.0); 675 Mbps D10.2 test pattern;
VID = 300 mVpp; EQ = 3 dB		 300mV setting only used with pre-emphasis
[300] mVpp
VOD(0.4) 400 mVpp
VOD(0.6) 600 mVpp
VOD(0.75) 800 mVpp
VEyemask Eyemask compliance VOD = 800 mVpp test pattern measured in compliance with PHY CTS1.1 section 3.1 at test point TP2; VID= 300mVPP ; EQ=3dB pass
VPRE(0.0) Driver output pre-emphasis VOD = VOD(0.4), VOD(0.6), or VOD(0.8) at 2.7Gbps only 0 dB
VPRE(2.5) VOD = VOD(0.3) or VOD(0.6) at 2.7Gbps only 2.7 dB
VPRE(3.5) VOD = VOD(0.4) at 2.7Gbps only; EQ=3dB 0.9 3.5 dB
VPRE(6.0) VOD = VOD(0.3) or VOD(0.4) at 2.7Gbps only; EQ=3dB 3.3 6.0 dB
VPRE(8.5) VOD = VOD(0.3) at 2.7Gbps only; EQ=3dB 7 8.5 dB
ROUT Driver output impedance (single ended) 100 Ω
RIN Differential input termination impedance 80 100 120 Ω
VItem Input termination voltage (AC coupled) Self-biased 0 1.7 2 V
VOCM Output common mode voltage 0 1.55 2 V
VTXACCM Output AC common mode voltage Verified through statistical measurements only using 1.62Gbps and 2.7Gbps PRBS7 data pattern measured at TP2; EQ = 3dB 20 mVrms
ITXSHORT Output short circuit current limit OUT[1:0] shorted to GND; single-ended current 50 mA
IRXSHORT Input short circuit current limit IN[1:0] shorted to GND (single ended) 50 mA
(1) This current consumption also applies to VOD = 400mV with 5.5 dB pre-emphasis or VOD = 600mV output swing and 2dB pre-emphasis
(2) This current consumption also applies to VOD = 300mV with 2 dB pre-emphasis
(3) This current consumption also applies to VOD = 300mV with 6dB pre-emphasis or VOD = 400mV output swing and 3.5dB pre-emphasis
(4) The SN75DP119 is designed to support the DisplayPort high speed differential main link with three levels of output voltage swing and three levels of pre-emphasis. The main link I/Os of the SN75DP119 are designed to be compliant with the DisplayPort 1.1a specification

7.6 Switching Characteristics

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tR/F(DP) Differential output edge rate (20%–80%) All VOD options, Measured at TP1, PRBS7;
VID = 300 mVPP; EQ = 3dB; CLOAD = 1 pF		 50 155 ps
tPD Propagation delay time 325 550 ps
tskpp Part-to-Part skew With identical voltage and temperature 0 160 ps
tSK(1) Intra-pair output skew Signal input skew = 0ps; dR = 2.7Gbps, No Pre-emphasis, 800 mVp-p , D10.2 pattern 20 ps
tSK(2) Inter-pair output skew 100 ps
ΔtDPJIT(PP) Peak-to-peak output residual jitter at package pins VOD(0.4); VPRE(0.0); Δtjit = tjit(output) – tjit(input); verified through design simulation and statistical measurements only using 1.62Gbps and 2.7Gbps PRBS7 data pattern. 15 ps

7.7 Typical Characteristics

DJ_TL_llse12.gifFigure 1. Deterministic Output Jitter vs Input Trace Length