JAJSVL7 November   2024 TAA3020

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: I2C Interface
    7. 5.7  Switching Characteristics: I2C Interface
    8. 5.8  Timing Requirements: TDM, I2S or LJ Interface
    9. 5.9  Switching Characteristics: TDM, I2S or LJ Interface
    10. 5.10 Timing Requirements: PDM Digital Microphone Interface
    11. 5.11 Switching Characteristics: PDM Digial Microphone Interface
    12. 5.12 Timing Diagrams
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Serial Interfaces
        1. 6.3.1.1 Control Serial Interfaces
        2. 6.3.1.2 Audio Serial Interfaces
          1. 6.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 6.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 6.3.1.2.3 Left-Justified (LJ) Interface
        3. 6.3.1.3 Using Multiple Devices With Shared Buses
      2. 6.3.2  Phase-Locked Loop (PLL) and Clock Generation
      3. 6.3.3  Input Channel Configurations
      4. 6.3.4  Reference Voltage
      5. 6.3.5  Programmable Microphone Bias
      6. 6.3.6  Signal-Chain Processing
        1. 6.3.6.1 Programmable Channel Gain and Digital Volume Control
        2. 6.3.6.2 Programmable Channel Gain Calibration
        3. 6.3.6.3 Programmable Channel Phase Calibration
        4. 6.3.6.4 Programmable Digital High-Pass Filter
        5. 6.3.6.5 Programmable Digital Biquad Filters
        6. 6.3.6.6 Programmable Channel Summer and Digital Mixer
        7. 6.3.6.7 Configurable Digital Decimation Filters
          1. 6.3.6.7.1 Linear Phase Filters
            1. 6.3.6.7.1.1 Sampling Rate: 7.35 kHz to 8 kHz
            2. 6.3.6.7.1.2 Sampling Rate: 14.7 kHz to 16 kHz
            3. 6.3.6.7.1.3 Sampling Rate: 22.05 kHz to 24 kHz
            4. 6.3.6.7.1.4 Sampling Rate: 29.4 kHz to 32 kHz
            5. 6.3.6.7.1.5 Sampling Rate: 44.1 kHz to 48 kHz
            6. 6.3.6.7.1.6 Sampling Rate: 88.2 kHz to 96 kHz
            7. 6.3.6.7.1.7 Sampling Rate: 176.4 kHz to 192 kHz
            8. 6.3.6.7.1.8 Sampling Rate: 352.8 kHz to 384 kHz
            9. 6.3.6.7.1.9 Sampling Rate: 705.6 kHz to 768 kHz
          2. 6.3.6.7.2 Low-Latency Filters
            1. 6.3.6.7.2.1 Sampling Rate: 14.7 kHz to 16 kHz
            2. 6.3.6.7.2.2 Sampling Rate: 22.05 kHz to 24 kHz
            3. 6.3.6.7.2.3 Sampling Rate: 29.4 kHz to 32 kHz
            4. 6.3.6.7.2.4 Sampling Rate: 44.1 kHz to 48 kHz
            5. 6.3.6.7.2.5 Sampling Rate: 88.2 kHz to 96 kHz
            6. 6.3.6.7.2.6 Sampling Rate: 176.4 kHz to 192 kHz
          3. 6.3.6.7.3 Ultra-Low Latency Filters
            1. 6.3.6.7.3.1 Sampling Rate: 14.7 kHz to 16 kHz
            2. 6.3.6.7.3.2 Sampling Rate: 22.05 kHz to 24 kHz
            3. 6.3.6.7.3.3 Sampling Rate: 29.4 kHz to 32 kHz
            4. 6.3.6.7.3.4 Sampling Rate: 44.1 kHz to 48 kHz
            5. 6.3.6.7.3.5 Sampling Rate: 88.2 kHz to 96 kHz
            6. 6.3.6.7.3.6 Sampling Rate: 176.4 kHz to 192 kHz
            7. 6.3.6.7.3.7 Sampling Rate: 352.8 kHz to 384 kHz
      7. 6.3.7  Automatic Gain Controller (AGC)
      8. 6.3.8  Voice Activity Detection (VAD)
      9. 6.3.9  Digital PDM Microphone Record Channel
      10. 6.3.10 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 6.4 Device Functional Modes
      1. 6.4.1 Sleep Mode or Software Shutdown
      2. 6.4.2 Active Mode
      3. 6.4.3 Software Reset
    5. 6.5 Programming
      1. 6.5.1 Control Serial Interfaces
        1. 6.5.1.1 I2C Control Interface
          1. 6.5.1.1.1 General I2C Operation
            1. 6.5.1.1.1.1 I2C Single-Byte and Multiple-Byte Transfers
              1. 6.5.1.1.1.1.1 I2C Single-Byte Write
              2. 6.5.1.1.1.1.2 I2C Multiple-Byte Write
              3. 6.5.1.1.1.1.3 I2C Single-Byte Read
              4. 6.5.1.1.1.1.4 I2C Multiple-Byte Read
  8. 7 Register Maps
    1. 7.1 Device Configuration Registers
    2. 7.2 Page_0 Registers
    3. 7.3 Page_1 Registers
    4. 7.4 Programmable Coefficient Registers
      1. 7.4.1 Programmable Coefficient Registers: Page 2
      2. 7.4.2 Programmable Coefficient Registers: Page 3
      3. 7.4.3 Programmable Coefficient Registers: Page 4
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Two-Channel Analog Microphone Recording
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Example Device Register Configuration Script for EVM Setup
      2. 8.2.2 Four-Channel Digital PDM Microphone Recording
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Example Device Register Configuration Script for EVM Setup
    3. 8.3 What to Do and What Not to Do
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Option Addendum
    2. 11.2 Tape and Reel Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

9.3 サポート・リソース

テキサス・インスツルメンツ E2E™ サポート・フォーラムは、エンジニアが検証済みの回答と設計に関するヒントをエキスパートから迅速かつ直接得ることができる場所です。既存の回答を検索したり、独自の質問をしたりすることで、設計で必要な支援を迅速に得ることができます。

リンクされているコンテンツは、各寄稿者により「現状のまま」提供されるものです。これらはテキサス・インスツルメンツの仕様を構成するものではなく、必ずしもテキサス・インスツルメンツの見解を反映したものではありません。テキサス・インスツルメンツの使用条件を参照してください。