JAJSVL7 November   2024 TAA3020

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: I2C Interface
    7. 5.7  Switching Characteristics: I2C Interface
    8. 5.8  Timing Requirements: TDM, I2S or LJ Interface
    9. 5.9  Switching Characteristics: TDM, I2S or LJ Interface
    10. 5.10 Timing Requirements: PDM Digital Microphone Interface
    11. 5.11 Switching Characteristics: PDM Digial Microphone Interface
    12. 5.12 Timing Diagrams
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Serial Interfaces
        1. 6.3.1.1 Control Serial Interfaces
        2. 6.3.1.2 Audio Serial Interfaces
          1. 6.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 6.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 6.3.1.2.3 Left-Justified (LJ) Interface
        3. 6.3.1.3 Using Multiple Devices With Shared Buses
      2. 6.3.2  Phase-Locked Loop (PLL) and Clock Generation
      3. 6.3.3  Input Channel Configurations
      4. 6.3.4  Reference Voltage
      5. 6.3.5  Programmable Microphone Bias
      6. 6.3.6  Signal-Chain Processing
        1. 6.3.6.1 Programmable Channel Gain and Digital Volume Control
        2. 6.3.6.2 Programmable Channel Gain Calibration
        3. 6.3.6.3 Programmable Channel Phase Calibration
        4. 6.3.6.4 Programmable Digital High-Pass Filter
        5. 6.3.6.5 Programmable Digital Biquad Filters
        6. 6.3.6.6 Programmable Channel Summer and Digital Mixer
        7. 6.3.6.7 Configurable Digital Decimation Filters
          1. 6.3.6.7.1 Linear Phase Filters
            1. 6.3.6.7.1.1 Sampling Rate: 7.35 kHz to 8 kHz
            2. 6.3.6.7.1.2 Sampling Rate: 14.7 kHz to 16 kHz
            3. 6.3.6.7.1.3 Sampling Rate: 22.05 kHz to 24 kHz
            4. 6.3.6.7.1.4 Sampling Rate: 29.4 kHz to 32 kHz
            5. 6.3.6.7.1.5 Sampling Rate: 44.1 kHz to 48 kHz
            6. 6.3.6.7.1.6 Sampling Rate: 88.2 kHz to 96 kHz
            7. 6.3.6.7.1.7 Sampling Rate: 176.4 kHz to 192 kHz
            8. 6.3.6.7.1.8 Sampling Rate: 352.8 kHz to 384 kHz
            9. 6.3.6.7.1.9 Sampling Rate: 705.6 kHz to 768 kHz
          2. 6.3.6.7.2 Low-Latency Filters
            1. 6.3.6.7.2.1 Sampling Rate: 14.7 kHz to 16 kHz
            2. 6.3.6.7.2.2 Sampling Rate: 22.05 kHz to 24 kHz
            3. 6.3.6.7.2.3 Sampling Rate: 29.4 kHz to 32 kHz
            4. 6.3.6.7.2.4 Sampling Rate: 44.1 kHz to 48 kHz
            5. 6.3.6.7.2.5 Sampling Rate: 88.2 kHz to 96 kHz
            6. 6.3.6.7.2.6 Sampling Rate: 176.4 kHz to 192 kHz
          3. 6.3.6.7.3 Ultra-Low Latency Filters
            1. 6.3.6.7.3.1 Sampling Rate: 14.7 kHz to 16 kHz
            2. 6.3.6.7.3.2 Sampling Rate: 22.05 kHz to 24 kHz
            3. 6.3.6.7.3.3 Sampling Rate: 29.4 kHz to 32 kHz
            4. 6.3.6.7.3.4 Sampling Rate: 44.1 kHz to 48 kHz
            5. 6.3.6.7.3.5 Sampling Rate: 88.2 kHz to 96 kHz
            6. 6.3.6.7.3.6 Sampling Rate: 176.4 kHz to 192 kHz
            7. 6.3.6.7.3.7 Sampling Rate: 352.8 kHz to 384 kHz
      7. 6.3.7  Automatic Gain Controller (AGC)
      8. 6.3.8  Voice Activity Detection (VAD)
      9. 6.3.9  Digital PDM Microphone Record Channel
      10. 6.3.10 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 6.4 Device Functional Modes
      1. 6.4.1 Sleep Mode or Software Shutdown
      2. 6.4.2 Active Mode
      3. 6.4.3 Software Reset
    5. 6.5 Programming
      1. 6.5.1 Control Serial Interfaces
        1. 6.5.1.1 I2C Control Interface
          1. 6.5.1.1.1 General I2C Operation
            1. 6.5.1.1.1.1 I2C Single-Byte and Multiple-Byte Transfers
              1. 6.5.1.1.1.1.1 I2C Single-Byte Write
              2. 6.5.1.1.1.1.2 I2C Multiple-Byte Write
              3. 6.5.1.1.1.1.3 I2C Single-Byte Read
              4. 6.5.1.1.1.1.4 I2C Multiple-Byte Read
  8. 7 Register Maps
    1. 7.1 Device Configuration Registers
    2. 7.2 Page_0 Registers
    3. 7.3 Page_1 Registers
    4. 7.4 Programmable Coefficient Registers
      1. 7.4.1 Programmable Coefficient Registers: Page 2
      2. 7.4.2 Programmable Coefficient Registers: Page 3
      3. 7.4.3 Programmable Coefficient Registers: Page 4
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Two-Channel Analog Microphone Recording
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Example Device Register Configuration Script for EVM Setup
      2. 8.2.2 Four-Channel Digital PDM Microphone Recording
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Example Device Register Configuration Script for EVM Setup
    3. 8.3 What to Do and What Not to Do
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Option Addendum
    2. 11.2 Tape and Reel Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

4 Pin Configuration and Functions

TAA3020 RTE Package,20-Pin WQFN With Exposed Thermal Pad,Top ViewFigure 4-1 RTE Package,20-Pin WQFN With Exposed Thermal Pad,Top View
Table 4-1 Pin Functions
PINTYPEDESCRIPTION
NO.NAME
1IN1PAnalog inputAnalog input 1P pin
2IN1MAnalog inputAnalog input 1M pin
3IN2P_GPI1Analog input/digital inputAnalog input 2P pin or general-purpose digital input 1 (multipurpose functions such as digital microphones data, PLL input clock source, and so forth).
4IN2M_GPO1Analog input/digital outputAnalog input 2M pin or general-purpose digital output 1 (multipurpose functions such as digital microphone clock, interrupt, and so forth).
5VSSGround supplyDevice ground internally shorted to thermal pad. Short this package corner pin directly to the board ground plane. See the package drawings at the end of this document for corner pin dimensions.
6SDOUTDigital outputAudio serial data interface bus output
7BCLKDigital I/OAudio serial data interface bus bit clock
8FSYNCDigital I/OAudio serial data interface bus frame synchronization signal
9IOVDDDigital supplyDigital I/O power supply (1.8V or 3.3V, nominal)
10VSSGround supplyDevice ground internally shorted to thermal pad. Short this package corner pin directly to the board ground plane. See the package drawings at the end of this document for corner pin dimensions.
11GPIO1Digital I/OGeneral-purpose digital input/output 1 (multipurpose functions such as digital microphones clock or data, PLL input clock source, interrupt, and so forth).
12SDADigital I/OData pin for I2C control bus
13SCLDigital inputClock pin for I2C control bus
14DREGDigital supplyDigital regulator output voltage for digital core supply (1.5V, nominal). Connect a 10-µF and 0.1µF low ESR capacitor in parallel to device ground (VSS).
15VSSGround supplyDevice ground internally shorted to thermal pad. Short this package corner pin directly to the board ground plane. See the package drawings at the end of this document for corner pin dimensions.
16AVDDAnalog supplyAnalog power (1.8V or 3.3V, nominal)
17AREGAnalog supplyAnalog on-chip regulator output voltage for analog supply (1.8V, nominal) or external analog power (1.8V, nominal). Connect a 10µF and 0.1µF low ESR capacitor in parallel to analog ground (AVSS).
18VREFAnalogAnalog reference voltage filter output. Connect a 1µF capacitor to analog ground (AVSS).
19MICBIAS_GPI2Analog output/digital inputMICBIAS output or general-purpose digital input 2 (multipurpose functions such as digital microphones data, PLL input clock source, and so forth). If used as MICBIAS output, then connect a 1µF capacitor to analog ground (AVSS).
20VSSGround supplyDevice ground internally shorted to thermal pad. Short this package corner pin directly to the board ground plane. See the package drawings at the end of this document for corner pin dimensions.
Thermal PadThermal Pad (VSS)Ground supplyThermal pad shorted to internal device ground. Short the thermal pad directly to the board ground plane.