Each system design and printed circuit board (PCB) layout is unique. The layout must
be carefully reviewed in the context of a specific PCB design. However, the
following guidelines can optimize the device performance:
- Connect the thermal pad to ground. Use a via pattern to connect the device
thermal pad, which is the area directly under the device, to the ground planes.
This connection helps dissipate heat from the device.
- Use the same ground between VSS and VSSA to avoid any potential voltage
difference between them.
- The decoupling capacitors for the power supplies must be placed close to the
device pins.
- Route the analog differential audio signals differentially on the PCB for better
noise immunity. Avoid crossing digital and analog signals to prevent undesirable
crosstalk.
- Avoid running high-frequency clock and control signals near OUTxx pins where
possible.
- The device internal voltage references must be filtered using external
capacitors. Place the filter capacitors near the VREF pin for good
performance.
- Provide a direct connection from the VREF external capacitor ground terminal to
the VSS pin.
- Use ground planes to provide the lowest impedance for power and signal current
between the device and the decoupling capacitors. Treat the area directly under
the device as a central ground area for the device, and all device grounds must
be connected directly to that area.