JAJSNP1 December   2023 TAD5242

ADVANCE INFORMATION  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements: TDM, I2S or LJ Interface
    7. 6.7 Switching Characteristics: TDM, I2S or LJ Interface
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Hardware Control
      2. 8.3.2 Audio Serial Interfaces
        1. 8.3.2.1 Time Division Multiplexed Audio (TDM) Interface
        2. 8.3.2.2 Inter IC Sound (I2S) Interface
      3. 8.3.3 Phase-Locked Loop (PLL) and Clock Generation
      4. 8.3.4 Analog Output Configurations
      5. 8.3.5 Reference Voltage
      6. 8.3.6 DAC Signal-Chain
        1. 8.3.6.1 Configurable Digital Interpolation Filters
          1. 8.3.6.1.1 Linear Phase Filters
            1. 8.3.6.1.1.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 8.3.6.1.1.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 8.3.6.1.1.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 8.3.6.1.1.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 8.3.6.1.1.5 Sampling Rate: 96 kHz or 88.2 kHz
            6. 8.3.6.1.1.6 Sampling Rate: 384 kHz or 352.8 kHz
    4. 8.4 Device Functional Modes
      1. 8.4.1 Active Mode
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Application
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
  11. 10Power Supply Recommendations
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 用語集
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

9 Application and Implementation

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.