JAJSKP5A December 2020 – September 2021 TAS2764
PRODUCTION DATA
All supply rails should be bypassed by low-ESR ceramic capacitors as shown in Figure 9-1 and described in Table 9-1.
Place the decoupling capacitors as close as possible to the respective power supply pins. Do not place vias between the decoupling capacitors and the device pin. Connect the vias to the ground or power planes on the far side of the capacitor.
Ground plane in the adjacent layer is recommended. It is required to maintain a single solid ground plane underneath the IC and its decoupling caps. Solid ground plane is the best option, providing continuous (uninterrupted) and low-impedance path for return currents back to the source. Fill the device side layer of the system board with ground copper and connect it to main ground plane using lots of vias. Each ground pin (GND, PGND) should directly shorted to the ground plane in the same layer as device as well as to the main solid ground plane in the adjacent layer through vias.
Specific layout design recommendations should be followed for this device: