JAJSEN9E october   2017  – july 2023 TAS2770

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements
    7. 6.7 TDM Port Timing Requirements
    8. 6.8 PDM Port Timing Requirements
    9. 6.9 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Device Mode and Address Selection
      2. 8.3.2 General I2C Operation
      3. 8.3.3 Single-Byte and Multiple-Byte Transfers
      4. 8.3.4 Single-Byte Write
      5. 8.3.5 Multiple-Byte Write and Incremental Multiple-Byte Write
      6. 8.3.6 Single-Byte Read
      7. 8.3.7 Multiple-Byte Read
      8. 8.3.8 Register Organization
    4. 8.4 Device Functional Modes
      1. 8.4.1  PDM Input
      2. 8.4.2  TDM Port
      3. 8.4.3  Playback Signal Path
        1. 8.4.3.1 High Pass Filter
        2. 8.4.3.2 Digital Volume Control and Amplifier Output Level
        3. 8.4.3.3 Audio Playback Selection
        4. 8.4.3.4 Battery Tracking Limiter with Brown Out Prevention
        5. 8.4.3.5 Inter Chip Limiter Alignment
          1. 8.4.3.5.1 TDM Mode
        6. 8.4.3.6 Class-D Settings
      4. 8.4.4  SAR ADC
      5. 8.4.5  IV Sense
      6. 8.4.6  Clocks and PLL
      7. 8.4.7  Operational Modes
        1. 8.4.7.1 Hardware Shutdown
        2. 8.4.7.2 Software Shutdown
        3. 8.4.7.3 Mute
        4. 8.4.7.4 Active
        5. 8.4.7.5 Mode Control and Software Reset
      8. 8.4.8  Faults and Status
      9. 8.4.9  Power Sequencing Requirements
      10. 8.4.10 Digital Input Pull Downs
    5. 8.5 Register Maps
      1. 8.5.1 Register Summary Table Book=0x00 Page=0x00
      2. 8.5.2 Register Maps
        1. 8.5.2.1  PAGE (book=0x00 page=0x00 address=0x00) [reset=0h]
        2. 8.5.2.2  SW_RESET (book=0x00 page=0x00 address=0x01) [reset=0h]
        3. 8.5.2.3  PWR_CTL (book=0x00 page=0x00 address=0x02) [reset=Eh]
        4. 8.5.2.4  PB_CFG0 (book=0x00 page=0x00 address=0x03) [reset=10h]
        5. 8.5.2.5  PB_CFG1 (book=0x00 page=0x00 address=0x04) [reset=1h]
        6. 8.5.2.6  PB_CFG2 (book=0x00 page=0x00 address=0x05) [reset=0h]
        7. 8.5.2.7  PB_CFG3 (book=0x00 page=0x00 address=0x06) [reset=0h]
        8. 8.5.2.8  MISC_CFG (book=0x00 page=0x00 address=0x07) [reset=6h]
        9. 8.5.2.9  PDM_CFG0 (book=0x00 page=0x00 address=0x08) [reset=0h]
        10. 8.5.2.10 PDM_CFG1 (book=0x00 page=0x00 address=0x09) [reset=8h]
        11. 8.5.2.11 TDM_CFG0 (book=0x00 page=0x00 address=0x0A) [reset=7h]
        12. 8.5.2.12 TDM_CFG1 (book=0x00 page=0x00 address=0x0B) [reset=2h]
        13. 8.5.2.13 TDM_CFG2 (book=0x00 page=0x00 address=0x0C) [reset=Ah]
        14. 8.5.2.14 TDM_CFG3 (book=0x00 page=0x00 address=0x0D) [reset=10h]
        15. 8.5.2.15 TDM_CFG4 (book=0x00 page=0x00 address=0x0E) [reset=13h]
        16. 8.5.2.16 TDM_CFG5 (book=0x00 page=0x00 address=0x0F) [reset=2h]
        17. 8.5.2.17 TDM_CFG6 (book=0x00 page=0x00 address=0x10) [reset=0h]
        18. 8.5.2.18 TDM_CFG7 (book=0x00 page=0x00 address=0x11) [reset=4h]
        19. 8.5.2.19 TDM_CFG8 (book=0x00 page=0x00 address=0x12) [reset=6h]
        20. 8.5.2.20 TDM_CFG9 (book=0x00 page=0x00 address=0x13) [reset=7h]
        21. 8.5.2.21 TDM_CFG10 (book=0x00 page=0x00 address=0x14) [reset=8h]
        22. 8.5.2.22 LIM_CFG0 (book=0x00 page=0x00 address=0x15) [reset=14h]
        23. 8.5.2.23 LIM_CFG1 (book=0x00 page=0x00 address=0x16) [reset=76h]
        24. 8.5.2.24 LIM_CFG2 (book=0x00 page=0x00 address=0x17) [reset=10h]
        25. 8.5.2.25 LIM_CFG3 (book=0x00 page=0x00 address=0x18) [reset=6Eh]
        26. 8.5.2.26 LIM_CFG4 (book=0x00 page=0x00 address=0x19) [reset=1Eh]
        27. 8.5.2.27 LIM_CFG5 (book=0x00 page=0x00 address=0x1A) [reset=58h]
        28. 8.5.2.28 BOP_CFG0 (book=0x00 page=0x00 address=0x1B) [reset=1h]
        29. 8.5.2.29 BOP_CFG1 (book=0x00 page=0x00 address=0x1C) [reset=14h]
        30. 8.5.2.30 BOP_CFG2 (book=0x00 page=0x00 address=0x1D) [reset=4Eh]
        31. 8.5.2.31 ICLA_CFG0 (book=0x00 page=0x00 address=0x1E) [reset=0h]
        32. 8.5.2.32 ICLA_CFG1 (book=0x00 page=0x00 address=0x1F) [reset=0h]
        33. 8.5.2.33 INT_MASK0 (book=0x00 page=0x00 address=0x20) [reset=FCh]
        34. 8.5.2.34 INT_MASK1 (book=0x00 page=0x00 address=0x21) [reset=B1h]
        35. 8.5.2.35 INT_LIVE0 (book=0x00 page=0x00 address=0x22) [reset=0h]
        36. 8.5.2.36 INT_LIVE1 (book=0x00 page=0x00 address=0x23) [reset=0h]
        37. 8.5.2.37 INT_LTCH0 (book=0x00 page=0x00 address=0x24) [reset=0h]
        38. 8.5.2.38 INT_LTCH1 (book=0x00 page=0x00 address=0x25) [reset=0h]
        39. 8.5.2.39 INT_LTCH2 (book=0x00 page=0x00 address=0x26) [reset=0h]
        40. 8.5.2.40 VBAT_MSB (book=0x00 page=0x00 address=0x27) [reset=0h]
        41. 8.5.2.41 VBAT_LSB (book=0x00 page=0x00 address=0x28) [reset=0h]
        42. 8.5.2.42 TEMP_MSB (book=0x00 page=0x00 address=0x29) [reset=0h]
        43. 8.5.2.43 TEMP_LSB (book=0x00 page=0x00 address=0x2A) [reset=0h]
        44. 8.5.2.44 INT_CFG (book=0x00 page=0x00 address=0x30) [reset=5h]
        45. 8.5.2.45 DIN_PD (book=0x00 page=0x00 address=0x31) [reset=0h]
        46. 8.5.2.46 MISC_IRQ (book=0x00 page=0x00 address=0x32) [reset=81h]
        47. 8.5.2.47 CLOCK_CFG (book=0x00 page=0x00 address=0x3C) [reset=Dh]
        48. 8.5.2.48 TDM_DET (book=0x00 page=0x00 address=0x77) [reset=7Fh]
        49. 8.5.2.49 REV_ID (book=0x00 page=0x00 address=0x7D) [reset=20h]
        50. 8.5.2.50 I2C_CKSUM (book=0x00 page=0x00 address=0x7E) [reset=0h]
        51. 8.5.2.51 BOOK (book=0x00 page=0x00 address=0x7F) [reset=0h]
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Overview
        2. 9.2.2.2 Select Input Capacitance
        3. 9.2.2.3 Select Decoupling Capacitors
        4. 9.2.2.4 Select Bootstrap Capacitors
      3. 9.2.3 Application Curves
    3. 9.3 Initialization Set Up
      1. 9.3.1 Initial Device Configuration - Auto Rate
      2. 9.3.2 Initial Device Configuration - 48 kHz
      3. 9.3.3 Initial Device Configuration - 44.1 kHz
      4. 9.3.4 Sample Rate Change - 48 kHz to 44.1kHz
      5. 9.3.5 Sample Rate Change - 44.1 kHz to 48 kHz
      6. 9.3.6 Device Mute
      7. 9.3.7 Device Un-Mute
      8. 9.3.8 Device Sleep
      9. 9.3.9 Device Wake
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
  14. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

概要

TAS2770 はモノラル、デジタル入力の Class-D オーディオ・アンプで、小型のスピーカーを効率的に駆動できるよう最適化されています。出力電力、保護機能、パッケージにより、TAS2770 はスマート・スピーカー、Bluetooth スピーカー、ホーム・オートメーション・デバイス、ノート PC、タブレットに最適です。

Class-D アンプは、16V で 4Ω 負荷に 20W の連続電力を供給し、16V では 15W を 8Ω 負荷に供給し、いずれも 1% THD です。4.5~16V の広い電圧入力範囲と高出力電力により、このアンプはバッテリ電源またはライン電源システムで動作するのに十分な汎用性を実現します。

ブラウンアウト防止機能はピーク電圧を追跡し、利用可能な電圧を超えないようにゲインを自動的に制限します。このハードウェア実装機能により、アンプのシステム電源への要求が減少し、オーディオ・カット・アウトとシステム・シャットダウンの両方を防止します。

TAS2770 は、従来のアンプとして、またはホスト・ベースのスピーカー保護アルゴリズムとともに使用できます。内蔵のスピーカー電圧および電流センスにより、リターン I2S パスを介して、保護アルゴリズムにスピーカーの状態をリアルタイムでフィードバックできます。

I2S/TDM + I2C により、最大 8 個のデバイスが同じバスを共有できます。

TAS2770 デバイスは 26 ピン、0.4mm ピッチの QFN で供給され、PCB 上の占有面積が小さくなります。

製品情報
部品番号パッケージ本体サイズ (公称)
TAS2770QFN4mm × 3.5mm
TAS2770DSBGA2mm × 2.52mm
SNP002770QFN4mm × 3.5mm
SNP002770DSBGA2mm × 2.52mm
TAS5770LC0 DSBGA 2mm × 2.52mm
GUID-EAC02902-9769-48D5-9014-C34857FD8B39-low.gif 機能ブロック図