SLOS795F September   2013  – October 2017 TAS5414C-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements for I2C Interface Signals
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Descption
      1. 7.3.1  Preamplifier
      2. 7.3.2  Pulse-Width Modulator (PWM)
      3. 7.3.3  Gate Drive
      4. 7.3.4  Power FETs
      5. 7.3.5  Load Diagnostics
      6. 7.3.6  Protection and Monitoring
      7. 7.3.7  I2C Serial Communication Bus
      8. 7.3.8  I2C Bus Protocol
      9. 7.3.9  Hardware Control Pins
      10. 7.3.10 AM Radio Avoidance
    4. 7.4 Device Functional Modes
      1. 7.4.1 Audio Shutdown and Restart Sequence
      2. 7.4.2 Latched-Fault Shutdown and Restart Sequence Control
    5. 7.5 Programming
      1. 7.5.1 Random Write
      2. 7.5.2 Sequential Write
      3. 7.5.3 Random Read
      4. 7.5.4 Sequential Read
    6. 7.6 Register Maps
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Hardware and Software Design
        2. 8.2.2.2 Parallel Operation (PBTL)
        3. 8.2.2.3 Input Filter Design
        4. 8.2.2.4 Amplifier Output Filtering
        5. 8.2.2.5 Line Driver Applications
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Consideration
    4. 10.4 Electrical Connection of Heat Slug and Heat Sink
    5. 10.5 EMI Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Links
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • PHD|64
サーマルパッド・メカニカル・データ
発注情報

Revision History

Changes from E Revision (January 2015) to F Revision

  • Changed the AEXC-Q100 Qualified Feature to include temperature and ESD classifications Go
  • Changed pin 33 From: CP_BOT To: CPC_BOT in the DKE package image Go
  • Changed pin 40 From: CP_BOT To: CPC_BOT in the PHD package image Go

Changes from D Revision (September 2014) to E Revision

  • Deleted text from step 4 of the Hardware Controls Pins section - "..if, not a quick ramp-down...entering standby." Go
  • Added the Programming section for Read, Write informationGo
  • Added a NOTE to the Applications and Implementation sectionGo
  • Added section title - Typical ApplicationGo
  • Changed Thermal Information To Thermal Consideration and moved the section after Layout ExampleGo

Changes from C Revision (July 2013) to D Revision

  • Added Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
  • Added the Device Information tableGo
  • Changed the Human body model (HBM) value From 3000 V To: ±2500 V Go
  • Added the Design Requirements sectionGo
  • Added the Application Curves Go
  • Added the Layout section Go

Changes from B Revision (April 2013) to C Revision

  • Added the TAS5424C-Q1 device to the data sheet.Go

Changes from A Revision (January 2013) to B Revision

  • Deleted the "Product Preview" banner Go

Changes from * Revision (January 2013) to A Revision

  • Deleted the 36-pin DKD package Features list itemGo
  • Deleted the 36 Pin DKD packageGo