SLOSE88 December   2024 TAS6754-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 ESD Ratings
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Supply
        1. 7.3.1.1 Power-Supply Sequence
          1. 7.3.1.1.1 Power-Up Sequence
          2. 7.3.1.1.2 Power-Down Sequence
        2. 7.3.1.2 Device Initialization and Power-On-Reset (POR)
      2. 7.3.2 Serial Audio Port
        1. 7.3.2.1 Left-Justified Timing
        2. 7.3.2.2 I2S Mode
        3. 7.3.2.3 DSP Mode
        4. 7.3.2.4 TDM Mode
        5. 7.3.2.5 SDOUT - Data Output
        6. 7.3.2.6 Device Clocking
          1. 7.3.2.6.1 Clock Rates
          2. 7.3.2.6.2 Clock Halt Auto-recovery
          3. 7.3.2.6.3 Sample Rate on the Fly Change
        7. 7.3.2.7 Clock Error Handling
      3. 7.3.3 Digital Audio Processing
        1. 7.3.3.1 PVDD Foldback
        2. 7.3.3.2 High-Pass Filter
        3. 7.3.3.3 Analog Gain
        4. 7.3.3.4 Digital Volume Control
          1. 7.3.3.4.1 Auto Mute
        5. 7.3.3.5 Gain Compensation Biquads
        6. 7.3.3.6 Low Latency Signal Path
        7. 7.3.3.7 Full Feature Low Latency Path
      4. 7.3.4 Class-D operation and Spread Spectrum Control
        1. 7.3.4.1 1L Modulation
        2. 7.3.4.2 High-Frequency Pulse-Width Modulator (PWM)
        3. 7.3.4.3 Spread Spectrum Control
        4. 7.3.4.4 Gate Drive
        5. 7.3.4.5 Power FETs
      5. 7.3.5 Load Diagnostics
        1. 7.3.5.1 DC Load Diagnostics
          1. 7.3.5.1.1 Automatic DC Load Diagnostics at Device Initialization
          2. 7.3.5.1.2 Automatic DC load diagnostics during Hi-Z or PLAY
          3. 7.3.5.1.3 Manual start of DC load diagnostics
          4. 7.3.5.1.4 Short-to-Ground
          5. 7.3.5.1.5 Short-to-Power
          6. 7.3.5.1.6 Shorted-Load and Open-Load
        2. 7.3.5.2 Line Output Diagnostics
        3. 7.3.5.3 AC Load Diagnostics
          1. 7.3.5.3.1 Operating Principal
          2. 7.3.5.3.2 Stimulus
          3. 7.3.5.3.3 Load Impedance
          4. 7.3.5.3.4 Tweeter Detection
        4. 7.3.5.4 Real-Time Load Diagnostics
        5. 7.3.5.5 DC Resistance Measurement
      6. 7.3.6 Protection and Monitoring
        1. 7.3.6.1 Overcurrent Limit (Cycle-By-Cycle)
        2. 7.3.6.2 Overcurrent Shutdown
        3. 7.3.6.3 Current Sense
        4. 7.3.6.4 DC Detect
        5. 7.3.6.5 Digital Clip Detect
        6. 7.3.6.6 Charge Pump
        7. 7.3.6.7 Temperature Protection and Monitoring
          1. 7.3.6.7.1 Overtemperature Shutdown
          2. 7.3.6.7.2 Overtemperature Warning
          3. 7.3.6.7.3 Thermal Gain Foldback
        8. 7.3.6.8 Power Failures
      7. 7.3.7 Hardware Control Pins
        1. 7.3.7.1 FAULT Pin
        2. 7.3.7.2 PD Pin
        3. 7.3.7.3 STBY Pin
        4. 7.3.7.4 GPIO Pins
          1. 7.3.7.4.1 General Purpose Input
          2. 7.3.7.4.2 General Purpose Output
        5. 7.3.7.5 Advanced GPIO functions
          1. 7.3.7.5.1 Clock Synchronization
            1. 7.3.7.5.1.1 External SYNC signal (GPIO sync)
            2. 7.3.7.5.1.2 Synchronization through the audio serial clock (SCLK)
            3. 7.3.7.5.1.3 TAS6754-Q1 as clock source for external devices
    4. 7.4 Device Functional Modes
      1. 7.4.1 Internal Reporting Signals
        1. 7.4.1.1 Fault Signal
        2. 7.4.1.2 Warning Signal
      2. 7.4.2 Device States and Flags
        1. 7.4.2.1 Audio Channel States
          1. 7.4.2.1.1 SHUTDOWN State
          2. 7.4.2.1.2 DEEP SLEEP State
          3. 7.4.2.1.3 LOAD DIAG State
          4. 7.4.2.1.4 SLEEP State
          5. 7.4.2.1.5 Hi-Z State
          6. 7.4.2.1.6 PLAY State
          7. 7.4.2.1.7 FAULT State
          8. 7.4.2.1.8 Auto Recovery (AUTOREC) State
        2. 7.4.2.2 Status and Memory Registers
      3. 7.4.3 Fault Events
        1. 7.4.3.1 Power Fault Events
          1. 7.4.3.1.1 DVDD Power-On-Reset (POR)
          2. 7.4.3.1.2 DVDD Undervoltage Fault
          3. 7.4.3.1.3 VBAT Undervoltage Fault
          4. 7.4.3.1.4 PVDD Overvoltage Fault
          5. 7.4.3.1.5 PVDD Undervoltage Fault
        2. 7.4.3.2 Overtemperature Shutdown (OTSD) Event
        3. 7.4.3.3 Overcurrent Limit Fault Event
        4. 7.4.3.4 Overcurrent Shutdown Event
        5. 7.4.3.5 DC Fault Event
        6. 7.4.3.6 Clock Error Event
        7. 7.4.3.7 Charge Pump Fault Event
      4. 7.4.4 Warning Events
        1. 7.4.4.1 Overtemperature Warning Event
        2. 7.4.4.2 Overcurrent Limit Warning Event
        3. 7.4.4.3 Clip Detect Warning Event
    5. 7.5 Programming
      1. 7.5.1 I2C Serial Communication Bus
      2. 7.5.2 I2C Address Selection
      3. 7.5.3 I2C Bus Protocol
      4. 7.5.4 Random Write
      5. 7.5.5 Sequential Write
      6. 7.5.6 Random Read
      7. 7.5.7 Sequential Read
  9. 8 Application Information Disclaimer
    1. 8.1 Application Information
      1. 8.1.1 Reconstruction Filter Design
    2. 8.2 Typical Application
      1. 8.2.1 BTL Application
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Electrical Connection of Thermal pad and Heat Sink
        2. 8.4.1.2 EMI Considerations
        3. 8.4.1.3 General Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.3.4.4 Gate Drive

The gate driver accepts the low-voltage PWM signal and level shifts it to drive a high-current, full-bridge, power-FET stage.

The device uses proprietary techniques to optimize EMI and audio performance. The gate driver power supply voltage, GVDD, is internally generated and a decoupling capacitor must be connected.

The full H-bridge output stages use only NMOS transistors. Therefore, bootstrap capacitors are required for the proper operation of the high side NMOS transistors for the OUT-xP sides. A 1-µF ceramic capacitor of quality X7R or better, rated appropriately for the applied voltages (including load dump voltages), must be connected from each output to the corresponding bootstrap input. The bootstrap capacitors connected between the BST pins and the corresponding output function as a floating power supply for the high-side N-channel power MOSFET gate drive circuitry. During each high-side switching cycle, the bootstrap capacitors hold the gate-to-source voltage high, keeping the high- side MOSFETs turned on.

The high-side FET gate driver of the OUT_xM side is supplied by a charge pump (CP) supply for all four channels. A 330 nF ceramic capacitor of quality X7R or better, rated appropriately for the applied voltages (including load dump voltages), must be connected from the CP pin to PVDD. Additionally, a similarly rated 100 nF ceramic capacitor must be connected from the CPC_TOP pin to the CPC_BOT pin.