JAJSGL7D December   2012  – September 2024 TCA9517A

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Timing Requirements
    8. 5.8 I2C Interface Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Two-Channel Bidirectional Buffer
      2. 7.3.2 Active-High Repeater-Enable Input
      3. 7.3.3 VOL B-Side Offset Voltage
      4. 7.3.4 Standard Mode and Fast Mode Support
      5. 7.3.5 Clock Stretching Support
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Clock Stretching Support
        2. 8.2.2.2 VILC and Pullup Resistor Sizing
      3. 8.2.3 Application Curve
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 ドキュメントの更新通知を受け取る方法
    2. 11.2 サポート・リソース
    3. 11.3 商標
    4. 11.4 静電気放電に関する注意事項
    5. 11.5 用語集
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information
    2. 13.2 Mechanical Data

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DGK|8
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC(1) TCA9517 UNIT
DGK (VSSOP) D (SOIC)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 187.6 133.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 59.3 87.6 °C/W
RθJB Junction-to-board thermal resistance 108.6 74.2 °C/W
ψJT Junction-to-top characterization parameter 3.4 36.9 °C/W
ψJB Junction-to-board characterization parameter 106.9 73.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.