JAJSHE4C may   2019  – june 2023 TCA9548A-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Reset Timing Requirements
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 RESET Input
      2. 8.4.2 Power-On Reset
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
      2. 8.5.2 Device Address
      3. 8.5.3 Bus Transactions
        1. 8.5.3.1 Writes
        2. 8.5.3.2 Reads
      4. 8.5.4 Control Register
      5. 8.5.5 RESET Input
      6. 8.5.6 Power-On Reset
  10.   Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  11.   Power Supply Recommendations
    1. 9.1 Power-On Reset Requirements
  12. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  13. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 ドキュメントの更新通知を受け取る方法
    3. 10.3 サポート・リソース
    4. 10.4 商標
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 用語集
  14.   Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1)TCA9548AUNIT
RGE (VQFN)
24 PINS
RθJAJunction-to-ambient thermal resistance57.2°C/W
RθJC(top)Junction-to-case (top) thermal resistance62.5°C/W
RθJBJunction-to-board thermal resistance34.4°C/W
ψJTJunction-to-top characterization parameter3.8°C/W
ψJBJunction-to-board characterization parameter34.4°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance15.5°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.