JAJSI83H May   2012  – September 2024 TCA9548A

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Interface Timing Requirements
    7. 5.7 Reset Timing Requirements
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 RESET Input
      2. 7.4.2 Power-On Reset
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
      2. 7.5.2 Device Address
      3. 7.5.3 Bus Transactions
        1. 7.5.3.1 Writes
        2. 7.5.3.2 Reads
      4. 7.5.4 Control Register
      5. 7.5.5 RESET Input
      6. 7.5.6 Power-On Reset
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power-On Reset Requirements
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 商標
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC(1) TCA9548A UNIT
PW (TSSOP) RGE (VQFN) DGS (VSSOP)
24 PINS 24 PINS 24 PINS
RθJA Junction-to-ambient thermal resistance 108.8 57.2 86.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 54.1 62.5 34.3 °C/W
RθJB Junction-to-board thermal resistance 62.7 34.4 47.3 °C/W
ψJT Junction-to-top characterization parameter 10.9 3.8 1.5 °C/W
ψJB Junction-to-board characterization parameter 62.3 34.4 47.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 15.5 N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.